Page 98 - TSMC 2022 Annual Report

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5 1 1 3 Consolidated Shipments and and Net Revenue in 2022 and and 2021
Unit: Shipments (thousand of 12-inch equivalent wafers) / Net Revenue (NT$ thousands)
Note Note 1: Domestic means sales to Taiwan Note Note 2: Others mainly include revenue associated with packaging and and testing services services mask making design services services and and royalties 5 1 1 4 Production in 2022 and 2021
Unit: Capacity / / Output (million 12-inch equivalent wafers) / / Amount (NT$ millions)
2022 15-16 15-16 15-16 15-16 2021
13-14 14-15
5 2 Technology
Leadership
5 2 1 R&D Organization and Investment
854 900
791 459
In 2022 TSMC continued to to to invest in in in in research and development with total R&D expenditures amounting to to to 7
2% of revenue a a a a a level that equals or exceeds the the R&D investment of many other leading high-tech companies Faced with the the continuous challenge to to significantly scale up semiconductor computing power every two years thereby extending Moore’s Law the Company has focused its R&D efforts on on contributing to to customers’ product success by offering leading-edge technologies and design solutions In 2022 the Company successfully started risk production of of N3E an an an an enhanced version of of N3 technology technology while the the the development of 2nm the the the leading-edge technology technology in in in the the the semiconductor industry at this time moved into baseline setup and the the the yield learning stage Furthermore the the the Company’s research efforts continued pushing forward with exploratory studies for nodes beyond 2nm In addition to to complementary metal oxide semiconductor (CMOS) logic TSMC conducts R&D on on on on a a a a a wide range of other semiconductor technologies that provide the the functionality required by customers for mobile SoC and other applications Highlights in in 2022 included:
● The Company’s integrated interconnect and packaging solution the 3DFabricTM showed significant progress by completing certification of HBM3 (third generation HBM) on on on on CoWoS-S qualifying InFO_PoP Gen-8 for mobile applications and enhanced thermal performance and developing on on on schedule the the next-generation InFO_PoP with backside redistribution layers (RDL) ● In specialty technologies examples of of of of progress included:
improving figure-of-merit of of of of 5V devices of of of of 55nm bipolar-CMOS-DMOS (BCD) technology technology and extended 0 13μm BCD BCD technology technology to to support 55V in in automotive applications qualifying next generation monolithic CMOS-MEMS technology with highly reliable 6-axis inertial measurement unit (IMU) starting risk-production of the world’s smallest chips of voltage domain global shutter CMOS image sensors with 3-wafer stack technology and demonstrating next generation MRAM with smaller cell size faster writing speed and more power saving for use in in in MCU AR/VR/edge-AI applications Shipments 2022 2021
Shipments Net Revenue Shipments Net Revenue Wafer Domestic (Note 1) 2 2 2 2 2 2 2 324 202 075 489 2 2 2 2 2 2 2 562 172 814 551
Export 12 929 1 1 1 1 1 1 789 780 458 11 617 1 1 1 1 1 1 232 485 722
Others (Note (Note 2) Domestic (Note (Note 1) N/A N/A 16 16 668 631 N/A N/A 13 055 166
Export N/A N/A 255 366 714 N/A N/A 169 059 598
Total Domestic (Note 1) 2 2 2 2 2 2 324 218 744 120 2 2 2 2 2 2 562 185 869 717
Export 12 929 2 2 2 2 2 045 147 172 11 617 1 1 1 1 1 1 1 1 401 545 320
Wafers
Year
Capacity Output Amount