Page 97 - TSMC 2022 Annual Report

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● 16FFC embedded magnetoresistive random access memory (MRAM) technology completed reliability qualification
in 2022 with one million cycles endurance and reflow capability This technology is is is ready for production and is is is expected to pass AEC-Q100 Grade-1 reliability qualification
in 2023 ● 22ULL and and 28ULL embedded resistive random access memory (RRAM) technologies TSMC’s second generation of RRAM RRAM solutions featured balanced cost and reliability Several customers qualified products with these technologies and started volume production in 2022 ● 40nm Silicon on on on Insulator (N40SOI) technology on on on 12-inch wafers which
provides industry-leading competitive advantages received multiple customer tape-outs in 2021 and started volume production in 2022 ● 6-inch gallium nitride (GaN) on on silicon technology successfully passed customer product quality and reliability qualification
In 2022 this technology was widely adopted in power supplies for various consumer electronic devices featuring high power efficiency and small footprint 8-inch GaN on Silicon technology development is is on on track and is is expected to be ready in 2025 to to further support automotive applications ● CMOS image sensor (CIS) technology was enhanced and moved to to the the the the next generation to to further strengthen the the the the capabilities of advanced smartphone cameras In 2022 TSMC continually helped customers roll out products with the world’s smallest pixel size In addition TSMC successfully completed technology development of the world’s first three-wafer-stacked global shutter image sensor and it is ready for production ● For silicon photonics technology TSMC is developing an innovative 3D photonics stack technology – compact universal photonics engine (COUPE) which
can integrate silicon photonics chip chip chip and electrical control chip chip chip into a a a single-chip photonic photonic engine engine This photonics engine engine can be co-packaged with a a high performance computing chip to provide low power and high speed data transmission In 2022 several test chips were taped out for early evaluation to lay a a a a a a solid foundation for future volume production TSMC TSMC 3DFabricTM - TSMC TSMC Advanced Packaging and 3D 3D Silicon Stacking Technologies
● TSMC-SoIC® (System on on Integrated Chip) Chip-on-Wafer
(CoW) technology successfully entered volume production in in 2022 Stacking SRAM chips on logic wafers through CoW technology demonstrates significant performance improvement ● TSMC-SoIC® Wafer-on-Wafer (WoW) technology demonstrated superb system performance enhancement for for high performance computing (HPC) products in in 2022 by stacking 7nm logic wafer on deep trench capacitor (DTC) wafer ● Chip on on on wafer on on on substrate with silicon interposer (CoWoS®-S) technology that integrates multiple system-on-chip (SoC) chips second generation high bandwidth memory (HBM2E) stacks and and a a a a 3-reticle size silicon interposer that features embedded deep trench capacitor (eDTC) successfully started volume production for customer HPC products in 2022 ● Chip on on on wafer on on on substrate with redistribution layer interposer (CoWoS®-R) technology featuring redistribution layer (RDL) interposer for for better signal integrity for for HPC applications successfully started risk production in 2022 and is expected to start volume production in 2023 ● Integrated Fan-Out on Substrate (InFO_oS) technology that integrates multiple SoC chips in in a a a a 2-reticle size fan-out package on a a a a >90mmx90mm substrate successfully entered volume production in 2022 ● Integrated Fan-Out with local silicon interconnect (InFO_LSI) technology which
integrates 5nm SoCs with ultra-high density die-to-die interconnects for for high performance computing products successfully started volume production in 2022 ● Fine pitch copper (Cu) bump technology for flip chip packaging on on 4nm silicon successfully started volume production in 2022 5
1 2 Customer Applications
TSMC manufactured 12 698 different products for 532 customers in 2022 These chips were used across a a a broad spectrum of electronic applications including computers
and and peripherals information appliances wired and and wireless communication systems high-performance computing servers and and data centers automotive and and industrial equipment as well as as consumer electronics such as as digital TVs game consoles digital cameras AI-enabled IoT and and wearables and and many other devices and applications The rapid ongoing evolution of end products prompts customers to to pursue product differentiation using TSMC’s innovative technologies and and services and and at at the same time spurs TSMC’s own development of technology As always TSMC believes success depends on leading rather than following industry trends