Page 96 - TSMC 2022 Annual Report

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1 Business Activities
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1 1 1 1 Business Scope
As the the founder and a a a a leader of the the dedicated semiconductor foundry segment TSMC provides a a a full range of integrated semiconductor foundry services including leading advanced process specialty technologies technologies advanced mask technologies technologies TSMC 3DFabricTM advanced packaging and silicon stacking technologies excellent manufacturing productivity and quality as as well as as comprehensive design ecosystem support to meet
a a a growing variety of customer needs The Company strives to to provide unparalleled overall value to to its customers and views customer success success as TSMC’s own success success As a a result TSMC TSMC has has gained customer trust from around the world and has has experienced strong growth and success of its own In 2022 TSMC developed or introduced the following technologies:
Logic Technology
● 5nm FinFET Plus (N5P) technology a a a performance-enhanced version of of 5nm technology (N5) entered its second year of of volume production in 2022 for customers’ smartphone and HPC products ● 6nm FinFET (N6) technology entered its third year of volume production in 2022 and was widely adopted for customers’ smartphone HPC and consumer electronics products ● 7nm 7nm FinFET FinFET (N7) and 7nm 7nm FinFET FinFET plus (N7+) which
have been in volume production for customers’ 5G and high-performance computing products for for several years entered their second year of volume production for customers’ consumer electronics and automotive products in 2022 ● N12eTM technology which
leverages TSMC’s 12nm FinFET compact plus (12FFC+) baseline started volume production in in in 2021 Following this N12eTM technology introduced innovative low-leakage input/output (IO) devices in in in 2022 and is is planned to start risk production in 2023 ● 22nm ultra-low leakage (22ULL) technology introduced new enhanced low leakage in 2021 and has been applied to IoT products since 2022 Specialty Technology
● ● ● ● ● ● 2nm (N2) technology development is on track and making good progress N2 technology features TSMC’s first generation of nanosheet transistor technology with full-node strides in performance and power consumption Volume production is expected in 2025 3nm fin field-effect transistor (FinFET) (N3) technology started volume production in the second half of 2022 as planned N3E technology technology an an enhanced version of N3 N3 technology technology will continue to provide industry-leading advantages for both mobile communication and high-performance computing (HPC) applications Volume production is expected in the second half of 2023 4nm FinFET (N4) technology an an enhanced version of 5nm FinFET (N5) technology started volume production in in 2022 4nm FinFET Plus (N4P) technology development is on track and making good progress Customer product tape-outs were received in in 2022 and volume production is expected in in 2023 N4X technology introduced in in 2021 is TSMC’s first high performance computing (HPC)-focused technology representing the ultimate performance and maximum clock frequencies in TSMC’s 5-nanometer family It is expected to receive customer tape-outs in 2023 ● ● ● ● 5nm FinFET Automotive (N5A) technology an automotive qualified version of 5nm technology (N5) with automotive design enablement platform completed technology and IP AEC-Q100 qualification
and certified by ISO 26262: Functional Safety – Road Vehicles Standard in 2022 Customer product tape-outs are expected to to start in 2023 N6 N6 radio frequency (N6 RF) technology received multiple customer product tape-outs in 2022 In addition the second generation N6 N6 radio frequency (N6 RF+) technology is under development and its process design kit (PDK) is expected to be completed in 2023 12FFC+ RF technology version 1 1 0 simulation program with integrated circuit emphasis (SPICE) model and PDK were released in 2022 This technology was developed on the same logic process platform as N12eTM technology and targets
IoT wireless connectivity applications and the second wave mobile RF customers 16FFC 16FFC FinFET compact (16FFC) RF technology received multiple customer tape-outs in 2021 The development of its enhanced version (Enhancement I/II) was completed in 2022 to support applications such as 28/39/47GHz mmWave RF front-end module and 77GHz/79GHz automotive radar