TSMC (TWSE: 2330, NYSE: TSM) created the semiconductor Dedicated IC Foundry business model when it was founded in 1987. In 2022, TSMC served 532 customers and manufactured 12,698 products for various applications covering a variety of end markets including high performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. Annual capacity of the manufacturing facilities managed by TSMC and its subsidiaries exceeded 15 million 12-inch equivalent wafers in 2022. These facilities include four 12-inch wafer GIGAFAB® fabs, four 8-inch wafer fabs, and one 6-inch wafer fab – all in Taiwan – as well as one 12-inch wafer fab at a wholly owned subsidiary, TSMC Nanjing Company Limited, and two 8-inch wafer fabs at wholly owned subsidiaries, WaferTech in the United States and TSMC China Company Limited. In December 2022, TSMC announced that, in addition to TSMC Arizona’s first fab, which is scheduled to begin production of N4 process technology in 2024, the Company has also started the construction of a second fab which is scheduled to begin production of 3nm process technology in 2026. At the same time, the Company continues to execute its plan for a fab in Kumamoto, Japan, with production targeted for 2024.
Market Capitalization as of 2/28/2023
NT$13.334 Trillion, or US$437.5 Billion
Shares Outstanding as of 2/28/2023
Common Shares: 25,930,380,458 shares
*Starting in 2015, TSMC prepares financial statements in accordance with 2013 IFRSs version endorsed by Taiwan. Under IFRS, the impact of newly effected GAAP shall be retroactively applied. Net Income for 2014 were adjusted accordingly.