Page 110 - TSMC 2022 Annual Report

assurance (AAA) initiative is key to OIP providing the precision and and quality required by the ecosystem interfaces and and collaborative components TSMC’s Open Innovation® model brings together the the creative thinking of of customers and partners under the common goal of of shortening each of the following: design time time time time to volume production time time to to market and ultimately time time to to revenue The model features:
● The in-person OIP Ecosystem Forum held by TSMC in in October 2022 after the the forum had been held online the the past two years due to COVID-19 pandemic This annual event demonstrates how TSMC and its ecosystem partners jointly develop design solutions on on top of TSMC’s advanced technologies At the forum TSMC made key presentations on on its TSMC FinFlexTM innovation that combines both process and design co-optimization for 3nm technology that continues the full-node power performance area (PPA) scaling trend together with the the offering of of high-density and and high-performance libraries and and design solutions for for the support of smartphone and HPC design applications The Company also made presentations on on the readiness
of analog analog cell that can help boost analog analog IP yield with the design solutions in 5nm 4nm and and 3nm to enable EDA and and design design flow automation to to support analog design design migration Other presentation topics included: enhanced automotive design design enablement platform (ADEP) with design design solutions and and ecosystems readily available in 16nm 7nm 5nm and and 3D chip stacking and 2 5D advanced packaging design solutions together with EDA tools that support 3DbloxTM ready to to to facilitate integration of multiple chips/chiplets in in customer’s system-level designs using TSMC 3DFabricTM technologies which include TSMC-SoIC® InFO (Integrated FanOut) and CoWoS® (Chip on on Wafer on on Substrate) The availability of the aforementioned design ecosystem solutions will help customers successfully pursue opportunities in all major markets: high performance computing mobile the IoT automotive and digital consumer electronics 5 5 5 5 Information Security Management
5 5 5 5 1 Information Security Policy and Organization
TSMC is committed to information security and confidentiality protection for its customers shareholders and partners To this end the Company has formulated implemented and regularly updated rigorous cybersecurity policies procedures and and measures to achieve information security and and confidential information protection as reflected in in TSMC’s “Information Security Declaration ”
Top TSMC executives are involved in in in planning the direction and implementation of this information security strategy with the goal of achieving optimum information security management The Company has established a a a a a a a dedicated organization Corporate Information Security (CIS) which is in charge of information security policy formulation implementation ● ● ● ● ● ● The foundry segment’s earliest and most comprehensive electronic design automation (EDA) certification program delivering timely design tool enhancement required by new process technologies The foundry segment’s largest most comprehensive and most robust silicon-proven IP (intellectual properties) and library portfolio Alliances that enable semiconductor designing in in the Cloud for the benefit of scalability agility and flexibility to meet different customer demand in work models Alliances that provide design services to to support customer demand regarding resources and and capabilities depending upon the the various scope and requirements in the the semiconductor design stages and value chain Alliances to to enable customers’ system-level designs for integrating multiple chips/chiplets in in in in 3D stacking and advanced packaging Participants consisting of 16 EDA partners partners six Cloud partners partners 37 IP partners partners 23 design center alliance (DCA) partners partners eight value chain aggregator (VCA) partners partners and 19 partners partners in in the new 3DFabric Alliance TSMC and partners work together proactively and and engage much earlier and and deeper than ever before in in order to address the mounting design challenges of advanced technology nodes Through this early and intensive collaboration TSMC’s OIP is able to deliver the needed design infrastructure with timely enhancement of EDA tools early availability of critical IPs and quality design services when customers need them Taking full advantage of the the process technologies once they reach production-ready maturity is critical to to customers’ success Hence this helps achieve design technology co-optimization (DTCO) among TSMC process technologies OIP design solutions and customer product designs A partner management portal which facilitates communication with ecosystem partners for efficient business productivity Designed with a a highly intuitive interface this portal can be accessed via a a a a a direct link from TSMC-OnlineTM 108
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