Page 162 - TSMC 2024 Annual Report

design low power high performance products to reduce resource consumption over the product’s life cycle TSMC’s green green manufacturing practices provide additional green green value to to customers and other stakeholders TSMC-manufactured ICs are used in a a a a a a broad variety of applications in in in various market segments including computer communications consumer industrial electric vehicle server and and data center and and other electronics Through TSMC’s manufacturing technologies customers’ designs are realized and their products are incorporated into people’s lives These chips therefore make significant contributions to the progress of modern society The Company endeavors to achieve profitable growth while providing products that add both environmental and social value Listed below are several examples of how TSMC-manufactured products make significant contributions to the environment and society Environmental Contributions by TSMC Foundry Services
1 Continuously Drive Technology to Reduce Power Consumption and Save Resources
● To play its part in in in in achieving sustainability TSMC continues to drive the development of advanced semiconductor process technologies to to help customers create more advanced energy-efficient and environmentally friendly products In each new technology generation circuitry line widths shrink making transistors smaller and reducing product power consumption for completing the same tasks or or achieving the same level of performance In addition calculations using the Industry Science and Technology International Strategy Center’s model reveal that in 2020 TSMC helped the world conserve 4 kWh kWh of energy for each 1 kWh kWh spent in production – a testimony to to TSMC’s commitment to to green manufacturing both internally and externally (Please refer
to “Sustainable Products by TSMC Facilitates Global Energy Conservation” on on on page 11 of TSMC’s 2020 Corporate Social Responsibility Report )
● As TSMC quickly ramped up its 7nm and newer generation technologies the combined wafer revenue contribution of 7nm and more advanced technologies grew significantly from 27% in in in 2019 to to 69% in in in 2024 TSMC’s objective is to to continue R&D investment and increase the wafer revenue contribution from 7nm and more advanced technologies helping the Company achieve both profitable growth and sustainability TSMC Wafer Revenue Contribution from 7nm and More Advanced Technologies
2019 2020 2021
2022
2023
2024 27% 41% 50%
53% 58%
69% Die Die size shrinks shrinks as line width shrinks shrinks Chip Die Die Size Cross-Technology Comparison
1 0 48
0 25
0 11 0 0 063
0 0 047
0 0 035
55nm 40nm 28nm
16FFC/ 10nm 7nm 12FFC
5nm 0 0 026
3nm
Note: The logic chip/SRAM/IO (input/output) ratio which affects die size and power consumption was re-aligned Chip Total Power Consumption Cross-Technology Comparison
More power is is saved as line width shrinks 160
0 0 015
Note: The logic chip/SRAM/IO (input/output) ratio which affects die size and power consumption was re-aligned 1 0 6 0 3 0 0 07
N55LP
(1 (1 2V) (1 (1 1V) (0 (0 (0 (0 (0 (0 9V) 12FFC
(0 (0 (0 (0 (0 (0 75V) 75V) 75V) 75V) (0 (0 (0 (0 (0 (0 75V) 75V) 75V) 75V) (0 (0 (0 (0 (0 (0 75V) 75V) 75V) 75V) (0 (0 (0 (0 (0 (0 75V) 75V) 75V) 75V) N40LP N28HPM
5nm 3nm
0 0 056
0 0 034
0 0 022
16FFC/ 10nm 7nm (0 8V)