Page 163 - TSMC 2024 Annual Report

2 Provide Customers Leading Power Management IC Processes with the Highest Efficiency
methodology based on its manufacturing excellence to help customers reduce design and process waste so as as to to produce more advanced energy-saving and environmentally friendly products For total energy savings and benefits realized in in 2024 through TSMC’s green manufacturing see Environmental Accounting on on page 158-159 in in this Annual Report Social Contributions by TSMC Foundry Services
1 Unleash Customers’ Mobile and Wireless Chip Innovations that Enhance Mobility and Convenience
● The rapid growth of smartphones and tablets in recent
years reflects strong demand for mobile devices which accelerates innovations for IC products such as as baseband RF transceivers application processors (AP) wireless local area networks (WLAN) CMOS image sensors (CIS) near-field communication (NFC) Bluetooth global positioning systems (GPS) ultra-wide band (UWB) organic light-emitting diode (OLED) display drivers and power management ICs (PMIC) among others These mobile devices offer remarkable convenience in in daily living and TSMC contributes significant value to these devices in in the the following ways: (1) new TSMC process technologies help chips achieve faster computing speeds in in smaller smaller sizes leading to to smaller smaller form factors for for these electronic devices In addition TSMC SoC technology integrates more functions into one chip reducing the total number of chips in in in electronic devices again resulting
in a a a smaller system form factor (2) new TSMC process technologies also help chips reduce power consumption allowing mobile devices to be used for a a longer period and (3) TSMC helps spread the growth of more convenient wireless connectivity such as 3G/4G/5G and WLAN/Bluetooth/ UWB meaning people can communicate more efficiently and “work anytime and anywhere ” significantly increasing the productivity and mobility of modern society 2 Unleash Customer Innovations in CMOS Image Sensor (CIS) and Micro-Electromechanical Systems (MEMS) that Enhance Human Health and and Safety and and Create Green Products ● TSMC’s leading manufacturing technologies help customers design and produce green products Power management chips the key components that supply and regulate power to all other IC components within electronic devices are the most notable green IC products TSMC helps customers produce industry-leading power management chips with more stable and and efficient power supplies and and lower energy consumption Power management ICs manufactured by TSMC for its customers are widely used in computer communication consumer electronics electric vehicle server and and data center and and other products or systems throughout the world 3 Drive the Industry-leading Comprehensive ULP Technology Platform
● To meet low-power consumption requirements for IoT markets such as smart smart wearable smart smart home health care and smart city for IoT products TSMC continues to invest in in in in expanding and and enhancing its ultra-low power processes The Company provides industry’s leading and most comprehensive ULP technology platform to support various smart smart edge devices including smart smart watches hearing aids pacemakers continuous glucose monitoring (CGM) devices environment monitoring and smart grid infrastructure TSMC’s industry-leading ULP offerings including the FinFET-based 6-nanometer technology N6e® and the 12-nanometer technology N12e® both of which feature energy efficiency and high performance for for enhanced computing power and AI inferencing as as well as as 22nm ultra-low leakage (ULL) 28nm
ULP ULP 40nm ULP ULP and 55nm ULP have been widely adopted in various Edge AI system-on-a-chip (SoC) and battery-powered applications TSMC has also extended its low Vdd offerings for extreme low-power applications 161
4 Develop Greener Manufacturing to Lower Energy Consumption ● TSMC continues to develop more advanced and efficient technologies to reduce energy/resource consumption and pollution per unit during the manufacturing process as well as power consumption and pollution during product use In each new technology generation circuitry line widths shrink making chips smaller for the same circuit designs and and lowering the energy and and raw materials consumed
for per chip in in manufacturing In addition the Company continuously provides process simplification and new design ● To make machines smarter safer and and more user and and environmentally friendly sensors are a a a a must Optical acoustic motion and environment sensors are mostly made using either CIS or MEMS technologies TSMC continues to put substantial effort into developing more advanced CIS and MEMS technologies to to to enable customers to to to create new products for new applications For CIS TSMC and customers have extended applications from traditional RGB (red green