Page 101 - TSMC 2022 Annual Report

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● Power IC/Bipolar-CMOS-DMOS (BCD)
TSMC continued to increase its 12-inch BCD technology competitiveness in 2022 The figure of of merit of of 5V devices of 55nm BCD technology was enhanced targeting power switches for portable devices The Company plans to further develop 28V and 5-16V for the 40nm BCD 20/24V technology platform The 22nm BCD technology offers 5V to 20V devices that are in reliability certification stage and has also extended 0 13μm BCD technology to to support 55V in automotive applications ● Micro-Electromechanical Systems (MEMS)
In 2022 TSMC implemented qualified piezoelectric micro electromechanical systems (MEMS)
technology for mass production of MEMS speakers with high audio quality and fast response In parallel TSMC’s capacitive micro-machined ultrasonic transducer (CMUT) MEMS technology was qualified for medical ultrasound imaging transducer chips with high image quality and and low cost and and entered the mass production stage In addition TSMC’s next generation monolithic CMOS-MEMS technology was qualified in 2022 to produce highly reliable 6-axis inertial measurement unit (IMU) for automotive safety and autonomous driving Future plans include the development of next-generation high-sensitivity piezoelectric microphones total solutions for high SNR automotive 6-axis IMU and medical single chip ultrasound probe applications ● Gallium Nitride (GaN)
TSMC’s first generation of 650V enhanced GaN high electron mobility transistors (E-HEMT) went into mass production in 2022 In order to to fill customer demand TSMC tripled its production capacity from 2021 levels Further to support the the Company’s leading position in in the GaN power transistor field the second generation of 650V and 100V power E-HEMT entered the final reliability assessment stage and will start production in in 2023 For GaN transistors application in in the automotive electronics market the third generation 650V power E-HEMT development was developed to be delivered in 2025 ● Complementary Metal-Oxide-Semiconductor (CMOS) Image Sensors
In 2022 TSMC made several major technical advances in CMOS image sensor technology including: (1) starting risk production of a new sub-micron pixel technology with 16% pixel area reduction for mobile imaging market (2)
risk-producing the world’s smallest voltage domain global shutter CMOS image sensor chips with 3-wafer stack technology for NIR/security camera market (3) completing the technology transfer of of silicon direct time-of-flight single photon avalanche diode (SPAD) process to a a a a a a a manufacturing fab for 3D distance sensing applications and (4) proceeding with risk production of stacked CMOS image sensors with N22 logic wafers as image signal processing units for high-dynamic range automotive imaging applications ● Embedded Flash/Emerging Memory
TSMC reached several major milestones in embedded non-volatile memory (NVM) technologies in 2022 At the 28nm node the Company’s embedded flash development for high-performance (HP) mobile computing and HP HP low-leakage platforms maintained a a a a a stable high yield consumer electronics grade for mass production achieved the highest automotive grade-0 qualification and are scheduled for product qualification in 2023 TSMC also offered RRAM as a a a a a low-cost embedded NVM solution for the price sensitive IoT market The Company’s 40nm & 28nm nodes entered mass production while the 22nm node was ready for production The Company also enjoyed several major accomplishments in embedded MRAM technology including TSMC’s 16nm node for automotive applications which is expected to to achieve technical qualification in 2023 TSMC also had demonstrated an an advancement in next generation memory cells with smaller cell size faster writing speed and more power saving to meet the requirements for MCU AR/VR/edge-AI applications 5 2 3 Technology Platform
TSMC provides customers with advanced technology platforms that include the comprehensive infrastructure needed to optimize design productivity and cycle times These include: electronic design design automation (EDA) design design flows silicon-proven libraries and and and IP and and and simulation and and and verification design design kits kits also known as process design design kits kits (PDKs) and technology files For the latest advanced technologies such as 3nm 4nm 5nm and TSMC 3DFabricTM the Company provides EDA tools features and IP solutions for adoption at at various design stages by customers for system innovation to to meet their product requirements To help customers plan new product tape-outs incorporating library/IP from the Company’s Open Innovation