Page 19 - TSMC 2020 Annual Report
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FinFET-based 12-nanometer technology – N12eTM featuring energy efficiency with high performance that results in more computing power and AI inferencing 22nm ULP/Ultra-low leakage (ULL) 28nm ULP ULP ULP 40nm ULP ULP ULP and 55nm ULP ULP ULP which have been widely adopted by various edge AI system-on-a-chip (SoC) battery-powered applications TSMC has also extended its low low Vdd (low operating voltage) offerings with wide-range operating voltage SPICE (simulation program with integrated circuit emphasis) models for extreme low-power applications TSMC also offers competitive and comprehensive specialty technologies in RF enhanced analog devices embedded flash memory memory emerging memory memory sensors and display chips as well as multiple 3DFabricTM advanced packaging technologies including leading InFO technology to support the fast-growing demand in in AIoT edge computing and and wireless connectivity Automotive Automotive Electronics: TSMC’s Automotive Automotive Electronics Electronics Platform provides a a comprehensive spectrum of technologies and services to support the three megatrends – safer smarter and greener – in in the automotive industry The Company is
also an industry leader in in in providing a a a a a robust automotive IP ecosystem which covers 16nm FinFET first and extends to 7nm FinFET FinFET and 5nm FinFET FinFET for advanced driver-assistance systems (ADAS) and advanced in-vehicle infotainment (IVI) the the two most computationally demanding systems in in the the automotive industry In addition to to its advanced logic platform TSMC offers broad and competitive specialty technologies including 28nm 28nm embedded flash memory 28nm 28nm 22nm and 16nm mmWave RF high sensitivity CMOS Image/LiDAR (light detection and and ranging) sensors and and power management ICs Magnetic random access memory (MRAM) an an emerging technology is
being developed with good progress to meet automotive automotive Grade-1 requirements All these automotive automotive technologies are applied to to TSMC’s automotive process qualification standards standards based on on AEC-Q100 standards standards Digital Consumer Electronics (DCE) Platform: TSMC provides customers with leading and comprehensive technologies to to deliver AI-enabled smart devices for DCE applications including smart digital TV TV (DTV) set-top box (STB) AI-embedded
smart camera and associated wireless local area network (WLAN) power IC timing controller (T-CON) and so on on The Company’s leading 7nm FinFET compact
(7FFC) 16FFC/12FFC 22ULP/22ULL and 28HPC+ technologies have been widely adopted by leading global makers for 8K/4K DTV 4K 4K streaming STB digital single-lens reflex (DSLR) devices and so on TSMC will continue to make these technologies more cost competitive through die size shrink for customers’ digital intensive chip designs and to lower power consumption for more cost-effective packaging TSMC continually strengthens its core competitiveness and deploys both short-term and long-term plans for technology and and business development and and assists customers in in in taking on the challenges of short product cycles and intense competition in the electronic products
market to meet ROI and growth objectives ● Short-Term Semiconductor Business Development Plan 1 Substantially ramp up the business and sustain advanced technology market share by continued increasing capacity
and R&D investments 2 Maintain mainstream technology market share by expanding
business to to new customers and market segments 3 Continue to enhance the the competitive advantages of the the Company’s platforms in smartphones high performance computing IoT and automotive electronics design ecosystems so as to expand TSMC’s dedicated foundry services in these product applications 4 Further expand TSMC’s business and and service infrastructure into emerging and developing markets ● Long-Term Semiconductor Business Development Plan 1 2 3 Continue developing leading-edge technologies at a a a a pace consistent with the Moore’s Law Broaden specialty business contributions by further developing derivative technologies Provide more integrated services covering system-level integration design design design design design design technology definition design design design tool preparation wafer processing 3DFabricTM advanced packaging and and silicon stacking technologies and and testing services and so on all of which deliver more value to customers through optimized solutions 

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