Page 77 - TSMC 2019 Annual Report

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speed and and a a a a a a reduction of
read noise for mobile applications and and the successful development of
3D metal-insulator-metal (MiM) high-density capacitors embedded inside an image sensor array for global shutter and high dynamic-range sensor applications needs TSMC and its EDA partners have created numerous deliverables from 0 13μm to 5nm that have successfully supported customer tape-outs 5
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Design Enablement
TSMC’s technology platforms provide a a a solid foundation to facilitate the the design design process Customers can design design using the the Company’s internally developed IP and tools tools or use tools tools available from TSMC’s OIP partners Tech Files and PDKs
EDA tool certification is an an essential element for IP and customer designs to ensure that features meet TSMC process technology requirements with certification results that can be found on on TSMC-OnlineTM There are corresponding tech files and process development kits (PDKs) available for customers to to download and design together with certified EDA tools TSMC provides a a a a a a broad range of
PDKs
for digital logic mixed-signal radio frequency (RF) high-voltage driver CMOS image sensor (CIS)
and embedded flash technologies across a a a a a range of
nodes from 0 5μm to 5nm In addition the Company provides tech files for design rule checking (DRC) layout verification of
schematic (LVS) resistance-capacitance (RC) extraction automatic place and route and a a a a layout editor to to ensure process technology information is accurately represented in EDA tools By 2019 TSMC had provided customers more than different 10 600 tech files and 360 PDKs
via TSMC-OnlineTM There are more than 100 000 customer downloads of
these files every year Library and IP Silicon intellectual property (IP) is the basic building block of
integrated circuit designs Various IP types are available to support different customer design applications including foundation IP IP IP IP IP analog IP IP IP IP IP embedded memory IP IP IP IP IP interface IP IP IP IP IP and soft IP IP IP IP IP To support 3D 3D IC IC customer needs TSMC also starts to to offer 3D 3D IC IC IP in 2019 TSMC and its alliance partners offer customers a a a a a rich portfolio of
reusable IPs which are essential building blocks for many circuit designs In 2019 the Company expanded its library and silicon IP portfolio to contain more than 26 000 items a a a a 30% increase over 2018 Design Methodology and Flow
Reference flows are built on top of
certified EDA tools to to to provide additional design flow methodology innovations that can help boost productivity In 2019 TSMC addressed critical design challenges associated with new 6nm and 3D IC technologies for digital and SoC applications by announcing the availability of
reference flows through OIP collaboration that feature FinFET- specific design solutions and TSMC-SoIC® (System-on-Integrated Chips) methodologies for for performance power and area optimization • Embedded Flash / Emerging Memory TSMC reached several major milestones in embedded non- volatile memory (NVM) technologies in 2019 At the 40nm node the Company successfully mass-produced NOR-based cell technology with split-gate cell to support consumer electronics such as IoT smartcards MCUs and numerous automotive electronics applications At 28nm node the Company’s embedded flash development for HP mobile computing and HP low-leakage platforms achieved technical qualification for for automotive electronics and MCUs TSMC also offered RRAM technology to be be embedded in NVM (non-volatile memory) technologies as a a low-cost solution for the price-sensitive IoT market 40nm node also achieved technical qualification as customer product qualifications continued The Company expects the 28nm node to enter production in 2020 Development
in 22nm node is on track and expected to pass technical qualification in in 2020 TSMC is also developing 22nm embedded MRAM technology which has achieved technical qualification to enter production Furthermore TSMC is developing 16nm embedded embedded MRAM for next generation embedded embedded memory MCUs automotive devices IoT and AI to to serve many new applications 5
2 3 Technology Platform
TSMC provides customers with advanced technology platforms that include the comprehensive design infrastructure required to optimize design productivity and cycle times These include: design design flows for electronic design design automation (EDA) silicon- proven libraries and and and IP building blocks and and and simulation and and and verification design design kits kits i fi i i i i i i e e e e e process design design kits kits (PDKs) and technology files For TSMC’s latest advanced technologies of
5nm 6nm 7nm 7nm+ 12nm 22nm and 3D IC design enablement platform EDA tools features and IP solutions are readily available for customers to to to adopt to to to meet their product requirements at various design stages The Company also extends its IP quality program (TSMC 9000) to to allow IP audits to to be performed either at at at TSMC TSMC or or or at at at TSMC-certified laboratories To help customers plan new product tape-outs incorporating library/IP from the Company’s Open Innovation Platform® (OIP) ecosystem the OIP ecosystem features a a a portal to to to connect
customers to to to 42
IP IP solution providers Overall TSMC and its IP IP partners have accumulated a a a a portfolio of
more than 26 000 IP titles from 0 35μm to to to 5nm with major IP types to to to meet customer design