Page 79 - TSMC 2018 Annual Report

Summary of TSMC’s Major Future R&D Projects
To achieve overall optimization of quality yield process and equipment the process control and analysis systems have been integrated with many intelligent functions to perform self-diagnosis self-learning and self-reaction These in in turn have demonstrated remarkable results in yield enhancement quality assurance workflow improvement fault detection cost reduction and shortening of the R&D cycle TSMC has developed systems for precise fault detection and classification intelligent advanced equipment control and intelligent advanced process control to to monitor the manufacturing process in in a a a a a a timely manner and adjust conditions precisely To achieve quality-first and ensure highly efficient and effective production the Company has created precision equipment matching and yield mining to minimize process variation and and potential defect and and excursion To meet the stricter quality requirements of mobile high performance computing automotive and the Internet of Things TSMC has further developed Big Data Machine Learning and Artificial Intelligence architecture which identify critical variables to strengthen process control optimize quality and improve yield management and operating efficiency simultaneously 5 3 3 3 3 Agile and Intelligent Operations
The Company’s sophisticated agile operation system continues to drive manufacturing excellence by integrating demand and and capacity modeling lean Work in in in Process (WIP) line management lot dispatching and and scheduling and and equipment quality performance to provide fast ramp-up short cycle time stable manufacturing on-time delivery and total quality satisfaction The system also provides great flexibility to quickly support customers’ urgent pull-in requests when needed TSMC has also introduced new applications such as as IoT intelligent mobile mobile devices and mobile mobile robots to consolidate data collection yield traceability workflow efficiency and material transportation to continuously enhance fab operation efficiency Committed to manufacturing excellence TSMC has integrated expert systems advanced algorithms artificial intelligence
and machine learning technology to build up an an an advanced manufacturing manufacturing environment Advanced manufacturing manufacturing technologies are widely applied in in in scheduling and dispatching people productivity productivity equipment productivity productivity process and equipment control control quality defense and robotic control control in order to optimize quality productivity efficiency and flexibility while maximizing cost effectiveness and accelerating overall innovation Project Name
Description
5th generation FinFET CMOS technology platform for for SoC 5nm logic technology platform and applications Beyond-5nm logic technology platform and applications 3D IC Next-generation lithography
Long-term research The projects above account for for roughly 70% of the total R&D budget for for 2019 around 9% of 2019 revenue 5 3 Manufacturing Excellence
5 3 1 GIGAFAB® Facilities
2019 2021
2018 - 2020
2018 - 2020
2018 - 2025
estimated to be Risk Production (Estimated Target Schedule)
6th generation FinFET CMOS technology platform for for SoC Cost-effective solution with better form factor and performance for for System-in- Package (SiP)
EUV lithography
and related patterning technology to extend Moore’s Law Specialty SoC technology (including new NVM MEMS RF analog) and transistors for 8 - 10 year out horizon
77
Maintaining dependable capacity is a a a a a a a key part of TSMC’s manufacturing strategy The Company currently operates three 12-inch GIGAFAB® facilities – Fabs 12 12 14 and 15 The combined capacity of the three facilities exceeded 8 million 12-inch wafers in in 2018 Production within these
three facilities supports 0 0 0 0 0 13μm 90nm 65nm 40nm 28nm 20nm 16nm 10nm and 7nm process technologies including each technology’s sub-nodes An additional portion of the capacity is reserved for R&D work on leading-edge manufacturing technologies which currently supports the the technology development of the the 5nm 3nm node and beyond The three GIGAFAB® facilities are coordinated by the centralized fab manufacturing management system known as super manufacturing platform (SMP) to to provide customers with greater benefits in the form of more consistent quality and reliability improved flexibility to cope with demand fluctuations faster yield learning and and time-to-volume and and lower-cost product requalification 5 3 2 Engineering Performance Optimization
As advanced technology continues to evolve and the geometry keeps shrinking the need for tighter process control and quality requirement has become extremely challenging for manufacturing manufacturing TSMC’s unique manufacturing manufacturing infrastructure
is tailored to handle a a a diversified product portfolio which uses strict process control to attain tightened specs and meet higher product quality performance and reliability requirements