Page 81 - TSMC 2018 Annual Report

Suppliers Accounting for at at Least 10% of Annual Consolidated Net Procurement
Unit: NT$ thousands
Company A Company B Company C C VIS
Company D
Others
Total Net Procurement
•
Supplier 2018 As % of 2018 Total Net Procurement
Relation to TSMC Procurement
Amount
2017
Procurement
Amount
As % of 2017
Total Net Procurement
Relation to TSMC 11 047 359
17%
None
8 8 8 868 953
17%
10 233 843
16%
None
8 029 455
15%
6 6 800 865
11%
None
5 5 579 238
10% 5 142 749
8%
Investee accounted for using equity method
5 5 5 755 727
11%
4 556 717
7%
None
5 5 5 156 154
10% 25 25 625 521
41%
- 19 804 126
37%
63 407 054
100%
- 53
53
193 653
100%
None
None
None
Investee accounted for using equity method
None
- - Reason for Increase or or or Decrease: Due to to market or or or customer product demand changes etc 5 5 3 5 5 Quality and Reliability
TSMC’s strong industry reputation stems from its commitment to to provide customers with the highest-quality wafers and best service for for their products Quality and and Reliability
(Q&R) services aim to to to achieve “quality on demand” to to to fulfill customers’ requirements for for time-to-market delivery product product reliability and competitiveness over a a a a a a a a a broad range of product product market market segments An automotive quality improvement program has been implemented to to meet customer requirements for low Defect Parts Per Million (DPPM) Q&R technical services assist customers in in the technology development stages stages and product product design design stages stages to to design-in superior product product reliability In 2018 Q&R worked with R&D in in advanced advanced logic technology technology technology specialty technology technology technology and advanced advanced packaging technology technology technology development and qualification Q&R has successfully qualified the the leading-edge 7nm+ technology (the third FinFET generation) which includes Extreme Ultraviolet (EUV) process process and characterized process process window with Fab for mass production in in in 2019 TSMC has led
the the industry in in in 7nm technology qualification The Company developed a a a a a a a complete model to simulate thermal dissipation effect during FinFET operation to to to provide more accurate electromigration electromigration (EM) design guideline for customers to to to develop statistical electromigration electromigration budgeting (SEB) model to to calculate effective metal electromigration failure rate on on on whole chip and implement it into electronic design automation (EDA) tool Through the 7nm+ development process process TSMC enhanced profound reliability learning with new process process steps and and new reliability methodologies which in turn provided an an an an important foundation for 5nm technology development and and prepared for 5nm risk production to start in 2019 For specialty technologies Q&R completed the second generation diffractive optical element (DOE) product qualification and ramped up up DOE unit production to to support a a a a a a a key customer’s new product product launch with 3D sensing and facial recognition applications In high-voltage technologies 0 0 13μm Bipolar-CMOS-DMOS (BCD) and 0 0 18μm third generation BCD BCD process passed automotive grade qualification For CoWoS® packaging technologies Q&R integrated high bandwidth memory (HBM) with advanced silicon technology and and and completed component level level level board level level level and and and customer product product system level level level qualifications It has been in production and and and over one
million units have been shipped to to key customers without quality or reliability issues The technology enables the applications of HPC and AI In In In addition Integrated Fan-Out (InFO) assembly technology for mobile applications moved into the third generation of manufacturing Over 70 million InFO InFO devices have been shipped without any InFO InFO related quality or reliability issues To enhance employee problem-solving capabilities and and develop related quality systems and and methodologies Q&R continued to hold several company-wide symposiums and training programs such as Total Quality Excellence (TQE) Design of Experiment (DOE) Statistical Process Control (SPC) and and metrology in in in in in in 2018 This included the promotion and and training of deep machine learning which was successfully applied to to to automatic classification of wafer defects and advanced spectral analysis to to to detect differences among processes and equipment so that corrective actions could be triggered In 2019 Q&R will continue the development of employee capabilities by promoting and using new methodologies to enhance TSMC competitiveness To improve raw material quality in in in 2017
Q&R began
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