Page 21 - TSMC 2024 Annual Report

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Early (N3AE) program providing automotive process design kits (PDKs) to to to support automotive customers N3AE has since migrated to to N3A with V0 9
PDK released in 2024 to to support customers to to to design automotive application products early on on In addition to its advanced logic platform TSMC offers a a a a a a a broad array of competitive automotive-grade specialty technologies including 28nm 28nm embedded flash memory 28nm 28nm 22nm and 16nm mmWave RF high dynamic range (HDR) high sensitivity CMOS image sensor (CIS)/light detection and ranging (LiDAR) sensors and PMICs The emerging technology of magnetoresistive random access memory (MRAM) demonstrated automotive Grade-1 capability on on 22nm and passed automotive Grade-1 requirements on 16nm in 2023 All these technologies have been applied to to TSMC’s automotive process qualification standards standards based on on AEC-Q100 standards standards of Automotive Electronic Council (AEC) and/or meeting customers’ technology specifications Digital Consumer Electronics (DCE): TSMC provides customers with leading comprehensive technologies to deliver AI-enabled smart smart devices for DCE applications including smart smart digital TVs (DTVs) set-top boxes (STBs) AI-embedded smart cameras and associated wireless local area networks (WLANs) PMICs and timing controllers (T-CONs) The Company’s leading N6 N7 16FFC/12FFC 22ULP/22ULL and 28HPC+ technologies have been widely adopted by leading global makers of 8K/4K DTVs and STBs 4K streaming media devices (SMDs)/over-the-top (OTT) digital single-lens reflex (DSLR) cameras and so on on TSMC will continue to make these technologies more competitive through DTCO for customers’ digital intensive chip designs and to drive lower power consumption for more cost-effective packaging TSMC continually strengthens its core competitiveness and deploys both short- and long-term plans for technology and and business development and and assists customers in in in tackling the challenges posed by short product cycles and intense competition in the electronic products market to achieve return on investment (ROI) and growth objectives ● Short-Term Semiconductor Business Development Plan 1 Substantially ramp up the business and sustain advanced technology market segment share by continually increasing
capacity and R&D investments 2 Maintain mainstream technology market segment share by expanding business to to new customers and and market segments 3 Continue to enhance the the competitive advantages of the the Company’s technology platforms in HPC smartphones IoT automotive and digital consumer electronics to to expand TSMC’s dedicated foundry services in these product applications 4 Further expand TSMC’s business and and service infrastructure into emerging and developing markets ● Long-Term Semiconductor Business Development Plan 1 2 3 Continue developing leading-edge technologies at a a a predictable pace to achieve greater energy-efficient computing Broaden specialty business contributions by further developing derivative technologies Provide more integrated services covering system-level integration design design design design design design technology definition design design design tool preparation wafer processing TSMC 3DFabric® advanced silicon stacking and and packaging technologies and and testing services etc all of which deliver more value to to customers through optimized solutions