Page 20 - TSMC 2024 Annual Report

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interconnect IPs to to meet customers’ product requirements for transferring and processing vast amounts of data anywhere at any any any time Specifically the Company introduced its HPC-focused technologies N4X and N3X representing the ultimate performance and maximum clock frequencies
in TSMC’s 5nm and 3nm families respectively Based on advanced process nodes a a a a a variety of HPC products have been launched such as AI AI AI accelerators including AI AI AI GPUs and AI AI AI ASICs PC CPUs consumer GPUs field programmable gate arrays (FPGAs) server processors and high-speed networking chips etc These products can be used in current and future 5G/6G infrastructures AI Cloud and enterprise data centers The Company also offers multiple TSMC 3DFabric® advanced silicon stacking and packaging technologies such as TSMC-SoIC® manufacturing service and Integrated Fan-Out (InFO) and CoWoS® advanced packaging services to enable homogeneous and heterogeneous chip integration to meet customer requirements for for high high performance high high compute density and and high high energy efficiency low latency and and high high integration TSMC will continue to optimize its HPC platform and strengthen collaboration with customers to to help them capture market market growth in HPC markets Smartphones: For customers’ premium product applications TSMC offers leading logic process technologies such as N2 Plus Plus (N2P) N3 N3 N3 Enhanced (N3E) N3 N3 N3 N4 N4 N4 Plus Plus (N4P) N4 N4 N4 N5 N5 N5 Plus (N5P) N5 N5 N5 as as well as as comprehensive IPs to further enhance chip performance reduce power consumption and decrease chip size For mainstream product applications the Company offers a a a a broad range of of logic process technologies including N4 N4 Compact (N4C) N6 7nm FinFET Plus (N7+) N7 N7 12nm 12nm FinFET FinFET Compact Compact Plus (12FFC+) 12nm 12nm FinFET FinFET Compact Compact (12FFC) 16nm 16nm FinFET FinFET Compact Plus (16FFC+) 16nm 16nm FinFET FinFET Compact Compact (16FFC) 28nm High Performance Compact Compact Plus (28HPC+) 28nm High Performance Compact (28HPC) and 22nm Ultra-Low Power (22ULP) in addition to comprehensive IPs to to satisfy customer needs for for high performance and low power chips Furthermore for both premium and mainstream product applications the Company offers leading-edge highly competitive specialty specialty technologies to deliver specialty specialty companion chips for customers’ logic application processors including radio frequency (RF) RF RF front-end embedded non-volatile memory power management ICs sensors and display chips as as well as as TSMC 3DFabric® advanced packaging technologies such as TSMC’s industry-leading InFO technology Internet of of Things: Following the the three megatrends of of the the IoT segment “Everything Connected Smart and Green ” TSMC not only provides customers with solid logic technologies including 5nm 6nm 6nm 7nm 12nm 16nm and 28nm but also builds
a a a a leading complete and highly integrated ULP technology platform based on its logic technologies to to enable customers’ product innovations for the artificial intelligence of things (AIoT) TSMC’s industry-leading ULP technologies including its new FinFET-based 6nm technology – N6e® and 12nm technology – N12e® feature both energy efficiency and high performance These technologies provide more computing power and AI inferencing capability while reducing system power consumption In addition the planar transistor based mainstream technologies such as 22nm ultra-low leakage (ULL) 28nm ULP ULP ULP 40nm ULP ULP ULP and 55nm ULP ULP ULP technologies have been widely adopted by various IoT system-on-a-chip (SoC) and battery-powered products to extend battery battery life TSMC’s ULP technology platform also provides customers with comprehensive specialty technologies covering RF enhanced analog devices embedded non-volatile memory sensors display devices and PMICs For extreme low power product application requirements TSMC has also extended its low operating voltage (Low Vdd) offerings and has provided simulation program with integrated circuit emphasis (SPICE) models with wide-range operating voltages and design guidelines to lower the adoption barrier and reduce lead time to to help customers successfully launch innovative products Automotive: TSMC offers a comprehensive spectrum of of technologies and services to to support the automotive industry’s three megatrends – building vehicles that are “Safer Smarter and Greener ” The Company is also an an an industry leader in in providing a a robust automotive IP ecosystem which covers 5nm FinFET FinFET FinFET 7nm FinFET FinFET FinFET and 16nm FinFET FinFET FinFET technologies for ADAS advanced in-vehicle infotainment (IVI) as as well as as zonal controllers for new E/E architectures in next-generation vehicles including internal combustion engines (ICEs) and electric vehicles (EVs) In 2023 TSMC introduced its N3 Auto