Page 113 - TSMC 2024 Annual Report

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Alliance that enables semiconductor designing in in the Cloud for the benefit of scalability agility and flexibility to meet various customer requirements for work models Alliance that provides design services to to support customer demand regarding resources and and capabilities depending on the the scope and various requirements in the the semiconductor design stages and value chain Alliance to to enables customers’ system-level designs for integrating multiple chips/chiplets in in in in 3D stacking and advanced packaging Participants consisting of 16 EDA partners seven Cloud partners partners 40 IP partners partners 29 design center alliance (DCA) partners partners eight value chain aggregator (VCA) partners partners and 23 partners in the new TSMC 3DFabric® Alliance A partner management portal to facilitate communication with ecosystem partners for efficient business productivity – designed with a a a a a a highly intuitive interface and accessible via a a a a a a direct link from TSMC-Online 2 5D advanced packaging design solutions together with EDA tools compliant to to to the 3Dblox® open standard to to to facilitate integration of multiple chips/chiplets in in system-level designs using 3DFabric® technology services which include TSMC-SoIC® InFO and CoWoS® The availability of the aforementioned design ecosystem solutions helps customers successfully pursue opportunities in all major markets: HPC smartphones the Internet of Things (IoT) automotive and digital consumer electronics 5 5 5 5 Information Security Management
5 5 5 5 1 Information Security Policy and Organization
TSMC is committed to information security and confidentiality protection for its customers shareholders and partners To this end the Company has formulated implemented and regularly updated rigorous cybersecurity policies procedures and measures as as reflected in TSMC’s Information Security Declaration In 2022 following the the regulations of the the Financial Supervisory Commission of Taiwan TSMC appointed J K Lin Senior
Vice President of Information Technology Material and Risk Management
to take on on the addition role of Chief Information Security Officer (CISO) Starting from 2025 TSMC appointed Cliff Hou Senior
Vice President and Deputy Co-COO as CISO who is responsible for the overall planning and coordination of Company resources communicating
on on on information security policies and directions TSMC has established a a a a a dedicated corporate information security (CIS) organization led by Director James Tu to to be responsible for the implementation planning monitoring and management of information security In 2024 in in response to TSMC’s global expansion the organization was renamed Global Security Management
(GSM) to integrate and enhance corporate security management TSMC has also established the PIP and Risk Committee Committee and the IT Security Committee Committee to cooperate with the Company’s information technology and related organizations to strengthen corporate information security protection and management mechanisms Both committees are chaired by the CISO and comprise VP-level executives
who meet regularly to review and deliberate on important information security policies as as well as as project implementation Every six months GSM executives
report risk management measures to the Audit and Risk Committee including global information information security security trends corporate information information security security policies plans and implementation results The chair of the Audit and Risk Committee also reports on the effectiveness of information security supervision and risk control measures to the Board of Directors TSMC and and partners work together proactively and and engage much earlier and deeper than ever before in order to address the mounting design challenges of advanced technology nodes Through this early and intensive collaboration OIP is is able to deliver the needed design infrastructure with timely enhancement of of EDA tools early availability of of critical IPs and quality design services when customers need them Taking full advantage of the the process technologies once they reach production-ready maturity is critical to to customer success Hence this helps achieve DTCO among TSMC process technologies OIP design solutions and customer product designs The 2024 annual OIP Ecosystem Forum in North America demonstrated how TSMC and its ecosystem partners jointly develop design solutions on on top of TSMC’s advanced technologies through OIP At the forum TSMC made key presentations on on its comprehensive 2nm technology family and TSMC A16TM that continue the full-node PPA scaling trend together with the the offering of of high-density and high-performance libraries and design solutions to support smartphone and high-performance computing (HPC) design applications The Company also made presentations on on on the readiness of analog analog cells that can help boost analog analog IP yields and analog design design productivity with the design design solutions to enable EDA and design flow automation to to support analog design migration In response to the rising demand for more complex system level designs TSMC TSMC collaborates with TSMC TSMC 3DFabric® alliance partners of 3DIC expertise in EDA IP DCA/ VCA memory substrate outsourcing semiconductor assembly testing testing (OSAT) and and testing testing to provide 3D chip stacking and and 111