Page 112 - TSMC 2024 Annual Report

reviewed analyzed and used to to develop appropriate improvement plans all all in in in all all becoming an an an an integral part of the customer satisfaction process Through surveys and feedback reviews TSMC is is able to to closely interact with customers provide better services and enhance the quality of customer collaboration Customer Information Protection
TSMC complies with applicable regulations and and and international standards to to protect customer information and and and has received ISO 27001 international information information security certification In addition relevant proprietary information information protection policies and and standard work processes are also established to ensure only authorized personnel can access the engineering and production data of any specific customer Customers Accounting for at at Least 10% of Annual Consolidated Net Revenue in in 2024 and 2023
Unit: NT$ thousands
Customer A Customer B Customer C C 624 345 477
352 271 213
N/A
22% None 546 550 925
12% None N/A
N/A
None 241 152 357
66% - 1 374 032 559
100% - 2 161 735 841
25% None N/A
None 11% None 64% - 100% - Customer 2024 2023
Net Revenue As % of 2024 Total Net Revenue Relation to TSMC Net Revenue As % of 2023
Total Net Revenue Relation to TSMC Others 1 1 1 917 691 009
Total Net Revenue 2 894 307 699
110
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Reason for Increase or or Decrease: The changes of sales amount and and percentage were mainly due to to customer product demand change 5 4 2 Open Innovation Platform®
At TSMC innovation has always been an exciting challenge Competition continues to intensify in in in in in in in in the face of increasing industry consolidation and and the commoditization of technology at at at at more mature conventional levels and and thus semiconductor companies must find ways to to to keep innovating in in in in in order to to to survive and prosper One way way to to to promote innovation is through active collaboration with external partners At TSMC this is is known as Open Innovation® an “outside in” approach to complement traditional “inside out” methods TSMC TSMC has chosen this path to stimulate innovation via its OIP initiative which is is a a a a a a a a a key part of the TSMC TSMC Grand Alliance The OIP initiative is a a a a a a a a a a comprehensive design technology infrastructure that encompasses all critical IC implementation areas to lower design design barriers and and improve design design cycle times and and first-time silicon success rates OIP promotes the speedy implementation of innovation within the semiconductor design community and and its ecosystem partners using TSMC’s process technology and and OIP partners’ solutions in design implementation and backend services Crucial to to OIP are ecosystem interfaces and and collaborative components initiated and and supported by TSMC to to empower innovation throughout the the supply chain and and and in in in turn drive the the creation and and and sharing of of new revenue and and and profits TSMC’s active accuracy assurance (AAA) initiative is is key to OIP providing the the precision and and quality required by the the ecosystem interfaces and and collaborative components TSMC’s Open Innovation® model brings together the the the creative thinking of of customers and partners under the the the common goal of of shortening each of the following: design time time time time time time time time to to to volume production time time time time to to to market and ultimately time time time time to to to revenue The model features:
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The foundry segment’s earliest and most comprehensive electronic design automation (EDA) certification program delivering
timely design tool enhancement required by new process technologies ●
The foundry segment’s most comprehensive and and robust silicon-proven IP (intellectual properties) and and library portfolio