Page 22 - TSMC 2022 Annual Report

ICs sensors and display chips as as well as as advanced TSMC 3DFabricTM packaging technologies such as industry-leading Integrated Fan-Out (InFO) technology Internet of Things: TSMC provides leading comprehensive and highly integrated ultra-low power (ULP) technology platforms to enable innovation in in in artificial intelligence of things (AIoT) applications The Company’s offerings include the new FinFET-based 12-nanometer technology – N12eTM featuring energy efficiency with high performance that
results in in in in more computing power and AI inferencing 22nm ultra-low leakage (ULL) 28nm ULP ULP ULP 40nm ULP ULP ULP and 55nm ULP ULP ULP technologies which have been widely adopted by various edge AI system-on-a-chip (SoC) and battery-powered applications TSMC has also extended its low operating voltage (Vdd) offerings providing simulation program with integrated circuit emphasis (SPICE) models with a a a a wide-range of operating voltages for extreme low-power applications In addition the Company offers competitive and comprehensive specialty technologies in RF enhanced analog devices embedded
flash memory memory emerging memory memory sensors and display chips power management ICs as as well as as multiple TSMC 3DFabricTM advanced packaging technologies including InFO technology to support the fast-growing demand in in in AIoT edge computing and wireless connectivity Automotive: TSMC offers a comprehensive spectrum of of technologies and services to to support the automotive industry’s three megatrends: safer smarter and greener The Company is also an industry leader in in in providing a a a a a robust automotive IP ecosystem which covers 5nm FinFET FinFET 7nm FinFET FinFET and 16nm FinFET technologies for advanced driver-assistance systems (ADAS) advanced in-vehicle infotainment (IVI) as as well as as zonal controllers for for new electrical/electronic (E/E) architecture for for the automotive industry In addition to to its advanced logic platform TSMC offers a a a a a broad array of of competitive specialty technologies including 28nm 28nm embedded
flash memory 28nm 28nm 22nm and 16nm mmWave RF high sensitivity CMOS Image/LiDAR (light detection and and ranging) sensors and and power management ICs The emerging technology of magnetoresistive random access memory (MRAM) has demonstrated automotive Grade-1 capability on 22nm and is under development with good progress on 16nm to to meet automotive Grade-1 requirements All these technologies are applied to to TSMC’s automotive process qualification standards standards based on on AEC-Q100 standards standards or meeting customers’ technology specifications Digital Consumer Electronics (DCE): TSMC provides customers with leading comprehensive technologies to to deliver AI-enabled smart devices for DCE applications including smart smart digital TV TV (DTV) set-top box (STB) AI-embedded smart smart camera and associated wireless local area network (WLAN) power management ICs (PMIC) timing controller (T-CON) and so on The Company’s leading 7nm FinFET (N7) 16FFC/12FFC 22ULP/22ULL and 28HPC+ technologies have been widely adopted by leading global makers of 8K/4K DTV 4K 4K streaming STB/over-the-top (OTT) digital single-lens reflex (DSLR) devices and so on on TSMC will continue to make these technologies more cost competitive through die size shrink for customers’ digital intensive chip designs and to drive lower power consumption for more cost-effective packaging TSMC continually strengthens its core competitiveness and deploys both short- and and long-term plans for technology and and business development and assists customers in in in taking on the challenges of short product cycles and intense competition in in the electronic products market to meet return on on investment (ROI) and growth objectives ● Short-Term Semiconductor Business Development Plan 1 Substantially ramp up the business and sustain advanced technology market segment share by continually increasing
capacity and R&D investments 2 Maintain mainstream technology market segment share by expanding business to to new customers and and market segments 3 Continue to enhance the the competitive advantages of the the Company’s technology platforms in HPC smartphones IoT automotive and digital consumer electronics to to expand TSMC’s dedicated foundry services in these product applications 4 Further expand TSMC’s business and and service infrastructure into emerging and developing markets ● Long-Term Semiconductor Business Development Plan 020
1 2 3 Continue developing leading-edge technologies at a a a predictable pace to elevate energy-efficient compute Broaden specialty business contributions by further developing derivative technologies Provide more integrated services covering system-level integration design design design design design design technology definition design design design tool preparation wafer processing TSMC 3DFabricTM advanced packaging and and silicon stacking technologies and and testing services and so on all of which deliver more value to customers through optimized solutions