Page 21 - TSMC 2022 Annual Report

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specialty technologies Beyond process technology TSMC has established frontend and backend integration capabilities to create the optimum power/performance/area “sweet spot” to help customers achieve faster time-to-production Well known for industry-leading manufacturing capabilities TSMC extends its its leadership through its its Open Innovation Platform® (OIP) and and Grand Alliance initiatives The OIP OIP initiative initiative accelerates the the pace of innovation in in the the semiconductor design community and among the Company’s ecosystem partners as as well as as in its own IP design implementation and design for manufacturing capabilities process technology and backend services A key element is a a a set of ecosystem interfaces and and collaborative components initiated and and supported by the Company that more efficiently empower innovation throughout the the supply chain and drive the the creation and and and sharing of of new revenue and and and profits The TSMC Grand Alliance is one of the most powerful forces for for innovation in in the the semiconductor industry bringing together customers electronic design automation (EDA) partners partners and IP partners partners along with the the partners in the the new 3DFabric Alliance officially announced in October 2022 and and key equipment and and material suppliers – all to achieve new higher levels of collaboration Through this collaboration the Grand Alliance’s objective is is to help customers alliance members and and TSMC win business and and improve competitiveness The foundation for customer trust is a a commitment TSMC made when it opened for business in in 1987 to never compete with its customers In keeping this commitment the Company has never designed manufactured or marketed any integrated circuits under its its its own name but instead has focused all of its its its efforts and resources on becoming the trusted foundry for for its customers Strategy
TSMC is confident that its competitive advantages will enable it it it to prosper from the foundry segment’s many attractive growth opportunities For the five major markets namely smartphones high performance computing the Internet of Things automotive and and digital consumer electronics and and in response to to the the fact that the the focus of customer demand
is shifting from process-technology-centric to product-application-centric the Company has constructed five corresponding technology platforms to to provide customers with comprehensive and competitive logic process technologies technologies specialty technologies technologies IPs and and packaging and and testing technologies to shorten customers’ time time to to to design and time time to to to market These five platforms are:
High Performance Computing (HPC): Driven by data explosion and application innovation HPC has become one of the key growth drivers for TSMC’s business TSMC TSMC provides customers including both fabless IC design companies and system companies with leading-edge process technologies such as 3nm FinFET FinFET FinFET (N3) 4nm FinFET FinFET FinFET (N4) 5nm FinFET FinFET FinFET (N5) 6nm FinFET FinFET FinFET (N6) 7nm FinFET FinFET FinFET (N7) and 12nm/16nm FinFET FinFET FinFET as well as comprehensive IPs IPs including high-speed interconnect IPs IPs to to meet customers’ product requirements for transferring and processing vast amounts of data anywhere and anytime In particular TSMC introduced its first HPC focused technology N4X representing the ultimate performance and maximum clock frequencies in TSMC’s 5-nanometer family Based on advanced process nodes a a a a a variety of HPC products have been launched such as personal computer central processing units (CPUs) graphics processor units (GPUs) field programmable gate arrays (FPGAs) server processors accelerators and high-speed networking chips etc These products can be used in in current and future 5G/6G infrastructures AI cloud and enterprise data centers The Company also offers multiple advanced TSMC 3DFabricTM packaging and silicon stacking technologies such as CoWoS® InFO and TSMC-SoIC® to enable homogeneous and heterogeneous chip integration to to meet customers’ requirements for for high high performance high high compute density and and high energy efficiency low latency and and high high integration TSMC will continue to optimize its high high performance computing platform and strengthen collaboration with customers to to help them capture market growth in HPC markets Smartphone: For customers’ premium product applications TSMC offers leading logic process technologies such as N3 N4 and N5 as as well as as comprehensive IPs to further enhance chip performance reduce power consumption and decrease chip size For mainstream product applications the Company offers a a a a broad range of of logic process technologies including N6 7nm FinFET FinFET Plus (N7+) N7 N7 12nm FinFET FinFET compact compact plus (12FFC+) 12nm FinFET compact compact (12FFC) 16nm 16nm FinFET FinFET compact compact plus (16FFC+) 16nm 16nm FinFET FinFET compact compact (16FFC) 28nm 28nm high performance compact (28HPC) 28nm 28nm high performance mobile compact plus (28HPC+) and 22nm ultra-low power (22ULP) logic process technologies in addition to to to comprehensive IPs to to to satisfy customer needs for for for high performance and low power chips Furthermore for for for premium and mainstream product applications the Company offers highly competitive leading-edge specialty technologies to to deliver specialty companion chips for customers’ logic application processors including RF embedded flash memory emerging memory technologies power management