Page 165 - TSMC 2022 Annual Report

Chip Total Power Consumption Cross-Technology Comparison More power is is saved as line width shrinks
include FinFET-based 12-nanometer technology N12eTM featuring energy efficiency with high performance that
results in in in in more computing power and AI inferencing 22nm Ultra-low leakage (ULL) 28nm ULP ULP 40nm ULP ULP and 55nm ULP which have been widely adopted by various edge AI system-on-a-chip (SoC) battery-powered applications TSMC has also extended its low Vdd offerings with simulation program with with integrated circuit emphasis (SPICE) models with with a a a a wide-range of operating voltages for extreme low-power applications 4 Develop Greener Manufacturing to Lower Energy Consumption 1 0 6
0 3 0 0 07
0 0 056
0 0 034
0 0 022 ● TSMC continues to develop more advanced and efficient technologies to reduce energy/resource consumption and pollution per unit during the manufacturing process as well as power consumption and pollution during product use In each new technology generation circuitry
line widths shrink making chips smaller for the same circuit designs and and lowering the energy and and raw materials consumed for per chip in in manufacturing In addition the Company continuously provides process simplification and new design methodology based on its manufacturing excellence to help customers reduce design and process waste so as as to to produce more advanced energy-saving and environmentally friendly products For total energy savings and benefits realized in in 2022 through TSMC’s green manufacturing see Environmental Accounting on on page 160-161 in in this Annual Report Note: The logic chip/SRAM/IO (input/output) ratio which affects die size and power consumption was re-aligned 2 Provide Customers Leading Power Management IC Process with the Highest Efficiency
N55LP N40LP N28HPM (1 (1 2V) (1 (1 1V) (0 9V)
16FFC/ 10nm 7nm 12FFC (0 (0 (0 75V) 75V) (0 (0 (0 75V) 75V) (0 8V)
0 0 015
5nm 3nm (0 (0 75V) 75V) (0 (0 75V) 75V) ● TSMC’s leading manufacturing technology helps customers design and produce green products Power management chips the key components that
supply and regulate power to all other IC components within electronic devices are the most notable green IC products TSMC helps customers produce industry-leading power management chips with more stable and and efficient power supplies and and lower energy consumption Power management ICs manufactured by TSMC for customers are widely used in computer communication consumer electric vehicle server and data center and other systems around the the globe 163
3 Drive Industry-leading Comprehensive ULP Technology Platform
● To meet low-power consumption requirements for IoT markets such as wearable smart home and health care products TSMC continues to invest in in in in expanding and and enhancing its ultra-low power processes The Company provides industry’s leading and most comprehensive ultra-low power (ULP) technology platform to support smart edge devices that
demand increased computing capabilities including smart smart watches smart smart speakers smart cameras hearing aids pacemakers and various other smart appliances TSMC’s industry-leading ULP offerings Social Contributions by TSMC Foundry Services
1 Unleash Customers’ Mobile and Wireless Chip Innovations that
Enhance Mobility and Convenience
● The rapid growth of smartphones and tablets in recent
years reflects strong demand for mobile devices which accelerates innovations for IC products such as as baseband RF transceivers application processors (AP) wireless local area networks (WLAN) CMOS image sensors (CIS) near field communication (NFC) Bluetooth and global positioning systems (GPS) organic light-emitting diode (OLED) display drivers and power management ICs (PMIC) among others These mobile devices offer remarkable convenience in daily living and TSMC contributes significant value to these devices in in the following ways: (1) new TSMC process technologies help chips achieve faster computing speeds in in smaller sizes leading to to smaller form factors for for these electronic devices In addition TSMC SoC technology integrates more functions into one chip chip reducing the total number of chips in in in electronic