Page 164 - TSMC 2022 Annual Report

7 2 2 2 2 Sustainable Products
TSMC collaborates with its upstream material and equipment suppliers design ecosystem partners and downstream assembly and testing service providers to minimize environmental impact Reducing the resources and energy consumed for each unit of production allows the Company to to provide customers with more advanced power efficient and ecologically sound products These include ultra-low power (ULP) and low low operating voltage (low Vdd) chips for wearables and IoT devices devices low-power chips for mobile devices devices high-efficiency LED driver chips for flat panel display backlighting indoor/ outdoor solid state LED lighting Energy Star certified low standby AC-DC adaptor chips high-efficiency DC DC brushless motor chips chips chips electric vehicle chips chips chips and low-power server chips chips chips By leveraging TSMC’s superior energy-efficient technologies these chips support sustainable city infrastructure greener vehicles smart grids more energy efficient servers and data centers and other applications In addition to helping customers design low power high performance products to to reduce resource consumption over the product’s life cycle TSMC’s green green manufacturing practices provide further green green value to to customers and other stakeholders TSMC-manufactured ICs are used in a a a a a a broad variety
of of applications in various segments of of the computer communications consumer industrial electric vehicle server and and data center and and other electronics markets Through TSMC’s manufacturing technologies customers’ designs are realized and their products are incorporated into people’s lives These chips therefore make significant contributions to to the progress of modern society TSMC endeavors to to achieve profitable growth while providing products that
add environmental and social value Listed below are several examples of how TSMC-manufactured products make significant contributions to the environment and society Environmental Contributions by TSMC Foundry Services
1 Continue to to Drive Technology to to Reduce Power Consumption and Save Resources
To play its part for sustainability TSMC continues to drive the development of advanced semiconductor process technologies to to support customers with creating more advanced energy-efficient and environmentally friendly products In each new technology generation circuitry
line widths shrink making transistors smaller and reducing product power consumption for completing the same tasks or or achieving the same level of performance In addition calculations using the Industry Science and Technology International Strategy Center’s model reveal that
in 2020 TSMC helped the world conserve 4 kWh of energy for each 1 kWh spent in production – a a testimony to TSMC’s commitment to green manufacturing both internally and externally (Please refer to “Sustainable Products
by TSMC Facilitates Global Energy Conservation” on on on page 11 of TSMC’s 2020 Corporate Social Responsibility Report ) ● As TSMC quickly ramped up its 7nm and newer generation technologies combined wafer revenue contribution grew significantly from 9% in in 2018 to 53% in in 2022 TSMC’s objective is to continue R&D investment and increase wafer revenue contribution in 7nm and beyond technologies helping the Company achieve both profitable growth and sustainability TSMC Wafer Revenue Contribution from 7nm and Beyond Technologies
2018 2019
2020 2021
2022 9% 27%
41% 50%
53% Chip Die Die Size Cross-Technology Comparison Die Die size reduces as line width shrinks
162
● 0 0 026
3nm 1 0 48
0 25
0 11 0 0 063
0 0 047
0 0 035
55nm 40nm 28nm 16FFC/ 10nm 7nm 12FFC 5nm Note: The logic chip/SRAM/IO (input/output) ratio which affects die size and power consumption was re-aligned