Page 12 - TSMC 2022 Annual Report

Corporate Developments
In December 2022 TSMC TSMC announced that in in addition to to TSMC TSMC Arizona’s first fab which is scheduled to to begin production of of N4 process technology in in in 2024 the the Company has also started the the construction of of a a a a a a a second fab in in in Arizona to begin production of 3nm process technology in in 2026 The overall investment for these two facilities will be approximately US$40 billion When completed TSMC Arizona’s two fabs will manufacture over 600 000 wafers per year In February 2022 TSMC Sony Semiconductor Solutions Corporation Corporation (SSS) and Denso Corporation Corporation jointly announced a a a a a a joint joint venture of Japan Advanced Semiconductor Manufacturing (JASM) In addition to to the previously announced 22/28 nanometer process process TSMC will also enhance JASM’s capabilities with 12/16 nanometer FinFET process process technology and increase monthly production capacity capacity to to 55 000 12-inch wafers With the the additional capacity capacity the the total capital expenditure for JASM’s Kumamoto fab is estimated to to be approximately US$8 6 billion with strong support from the Japanese government Honors and Awards
TSMC received recognition for achievements in in in in innovation corporate governance sustainability investor relations and overall excellence in in in in management from organizations including Forbes Fortune Magazine Asiamoney The Asset CommonWealth Magazine Taiwan Taiwan Stock Exchange and Taiwan Taiwan Institute for Sustainable Energy For innovation TSMC was recognized as as 3rd in in IFI Claims Patent Patent Services’ “2022 Top 50 US Patent Patent Assignees ” TSMC was also recognized by Fortune Magazine as as “2022 World’s Most Admired Companies ” In sustainability we we were chosen once again as a a a a a a a component of the Dow Jones Sustainability Indices becoming the only semiconductor company to to be be selected for 22 consecutive years We also received MSCI ESG ESG Research’s AAA Rating CDP’s “2022 CDP CDP Supplier Engagement Leader ” Sustainalytics’ “Company ESG ESG Risk Ratings-Low ESG ESG ESG Risk” rating ISS ESG’s “Prime” status in in in in the ESG ESG ESG Corporate Corporate Rating Rating and Corporate Corporate Knight’s “2022 Global 100 Most Sustainable Corporations ” Meanwhile we remained a a a a a a a a a major component in in in various MSCI ESG and FTSE4Good indices In In In investor relations TSMC continued to to to receive multiple awards from Institutional Investor Magazine Outlook
Entering 2023 macroeconomic and and geopolitical uncertainties persist As global COVID-19 pandemic subsides we have entered a a a a a more intelligent and and connected world As semiconductors become increasingly essential and and ubiquitous to to to every part of our daily lives semiconductor technology technology is becoming a a a a a a foundational technology technology for the modern digital economy The semiconductor value value in in in in in the global supply chain continues to to increase creating greater value value opportunities for our customers and greater value opportunities for TSMC It is is more important than ever for for TSMC to to fulfill our mission to to be the the trusted technology and capacity provider for for the the global logic IC industry for years to come We will uphold our Trinity of of Strengths of of Technology Leadership Manufacturing Excellence and and Customer Trust to to address and and capture the strong growth opportunities We are increasing our our investments in in in in in R&D to to continue to to extend our our overall competitiveness and technology leadership With our leadership in in both leading edge process technologies and 3DIC solutions TSMC’s technology cadence
remains constant to to to to deliver the the value of our our technology platform and to to to to help our our customers to to to to enhance their product competitiveness and to to grow their markets well into the the future We continue to to focus on on on optimizing our manufacturing operations to to drive greater efficiency and productivity including “digitalization” of of our fabs to support high volume ramp of of N3 in 2023 and beyond 010