Page 10 - TSMC 2022 Annual Report

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TSMC generated net income of of US$34 07 billion billion on on on on consolidated revenue of of US$75 88 billion billion which increased 59 6 percent and and 33 5 5 5 percent respectively from the 2021 level of US$21 35 billion billion net income and and US$56 82 billion billion consolidated revenue Gross profit profit margin margin was was 59 6 6 percent percent as as as compared with 51 6 6 percent percent in in in in 2021 while operating profit profit margin margin was was 49 5 5 5 percent percent percent percent compared with 40 9
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percent percent percent percent a a a a a a a a a year earlier Net profit margin was 44 9
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percent percent percent percent an increase of of 7 3 percentage points from 2021’s 37 6 percent In 2022 the the Company further raised its total cash dividend payments to to NT$11 0 0 0 per share up from NT$10 25 a a a a a a a a a year ago Technological Developments
In 2022 we continued to to to increase our our investment in in in in R&D to to to US$5 47 billion to to to extend our our technology leadership and differentiation We also work closely with our customers to to to to enable the the global pool of innovators to to to to unleash their innovations and create greater value for the semiconductor industry In its third year of of of ramp our 5-nanometer family of of of technologies contributed 26% of of of TSMC’s revenue We continued to enhance our N5 family’s performance power and and density and and N4 started volume production in in 2022 We also introduced N4P N4P and and N4X technologies targeting next wave 5nm products N4P N4P technology development is well on track and and volume production is is scheduled in in 2023 N4X is is TSMC’s first HPC-focused workload-intensive technology with customers’ product product tape-outs in 2023 After N3 N3 N3 technology entered volume production in 2022 N3E will further extend our N3 N3 N3 family with enhanced performance power and yield Volume production of of N3E is scheduled for 2H’23 We are working on on a a a high level of of customer engagement at at both N3 N3 and and N3E with the number of of tape-outs more than 2x that of of N5 in its first and and second year We expect our N3 family to be another large and long-lasting node for TSMC Our 2-nanometer technology will adopt nanosheet transistor structure and and deliver full-node performance and and power efficiency gains with 10-15% speed speed improvement improvement at at the the same same power power or 25-30% power power improvement improvement at at the the same same speed speed as compared to to to N3E to to to address the the increasing need for energy-efficient computing N2 will provide our customers with the the best performance cost and and technology technology maturity and and extend our technology technology leadership position well into the future As TSMC TSMC pushes the envelope of transistor scaling we also continue to to expand our TSMC TSMC 3DFabricTM design solutions as another dimension to improve system-level performance TSMC 3DFabricTM consists of both wafer-level 3D 3D and advanced packaging technologies technologies For our 3D technologies technologies TSMC-SoIC® Chip-on-Wafer (CoW) technology successfully entered volume production in in in 2022 demonstrating significant performance improvement by stacking SRAM chips on on on logic wafers TSMC-SoIC® Wafer-on-Wafer (WoW) technology demonstrated superb system performance enhancement for for HPC products in in in 2022 by stacking 7nm logic wafer wafer on deep trench capacitor wafer wafer For our advanced packaging technologies the CoWoS®-S technology that integrates multiple system-on-chip (SoC) chips high bandwidth memory stacks and and a a a a a a 3-reticle size silicon interposer successfully entered volume production for customer HPC products in in 2022 For InFO advanced packaging technology TSMC successfully entered volume production of Integrated Fan-Out on on Substrate (InFO_oS) that integrates multiple SoC chips in in a a a a a 2-reticle size fan-out package