Page 83 - TSMC 2019 Annual Report

wafer wafer yields and and wafer wafer acceptance test analysis as as well as as quality and and reliability data Logistics collaboration includes information of wafer fabrication backend process and shipments in client orders Customer Satisfaction
To ensure customer customer satisfaction and to to to make sure sure we fully apprehend customer customer needs TSMC appoints third party consulting firms to to to conduct customer customer satisfaction survey survey (ACSS) with majority of our existing customers through either web survey survey or or interview on on on an annual basis In addition to to to to the survey customer customer service team also conduct quarterly business reviews (QBRs) with our customers to to to to make sure we receive customers’ feedbacks on a a a a a a a a regular basis Through surveys and feedback feedback reviews TSMC is is able to to to closely interact with customers customers provides better services and enhances quality of collaborations Customer feedback is routinely reviewed analyzed and then used to to develop appropriate improvement plans all all in in in all all becoming an an integral part of the the the customer satisfaction process TSMC uses the the the results derived from the the the survey as as important basis for future developments and and we firmly believe that customer customer satisfaction leads to to to healthy customer customer relationships and and business growths Customers
Accounting for at at Least 10% of Annual Consolidated Net Revenue
Unit: NT$ thousands
Customer A Customer B 247 213 291
152 876 885
23% None None 224 690 695 22% None None 14% None None 83 885
616 8% None None Customer 2019 2018
Net Revenue
(Note)
As % of 2019 Total Net Revenue
Relation to TSMC Net Revenue
(Note)
As % of 2018
Total Net Revenue
Relation to TSMC Others 669 895 272 63%
- - 722 897 246 70% - - Total Net Revenue
1 1 1 1 1 069 985 448 100% 100% - - 1 1 1 1 1 031 473 557 100% 100% - - Note: Commencing in in in 2018
the the Company began to to break down the the net revenue by customer based on a a a a a a a a a a a a a a new method which associates most estimated sales sales returns and allowances with individual sales sales transactions as as opposed to the the the previous method method which allocated sales returns and allowances based on on on the the the aforementioned gross revenue The Company believes the the the new method method provides a a a a a a a a a a a a a more relevant breakdown than the previous one Reason for Increase or or Decrease: The changes of sales amount and and percentage were mainly due to to customer product demand change 81
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5 4 2 Open Innovation Platform® (OIP) Initiative
Innovation has always been an an an exciting and challenging proposition Competition among semiconductor companies continues to to intensify in in in in in the the face of of increasing industry consolidation and the the commoditization of of technology at at at at more mature conventional levels Companies must find ways to to to keep innovating fin in in in in order to to to survive and prosper One way way to to to promote innovation is through active collaboration with external partners At TSMC this is is is known as “Open Innovation® ” ” It is is is an “outside in” approach to complement traditional “inside out” methods TSMC has chosen this path to innovation via its Open Innovation Platform® (OIP) initiative which is is a a a a a a a a a a key part of the TSMC Grand Alliance The OIP initiative is a a a a a a a a a a comprehensive design technology infrastructure that encompasses all critical IC implementation areas to lower design barriers and improve first-time silicon success OIP promotes the the speedy implementation of innovation amongst the the semiconductor design design community and and its ecosystem partners using TSMC’s IP design design implementation process technology and and backend services Crucial to to OIP are ecosystem interfaces and and collaborative components initiated and and supported by TSMC to to empower innovation throughout the the supply chain and and and in in in turn drive the the creation and and and sharing of o new revenue and and and profits TSMC’s active accuracy assurance (AAA) initiative is key to OIP providing the the accuracy and and quality required by the the ecosystem interfaces and and collaborative components