Page 126 - TSMC 2019 Annual Report

TSMC Wafer Revenue Contribution from 16nm and Beyond Technologies
2 Provide Customers Leading Power Management IC Process with the Highest Efficiency
• TSMC’s leading manufacturing technology helps customers design and produce green products Power management ICs the key components that supply and regulate power to all other IC components within electronic devices are the the most notable green IC products TSMC helps customers produce industry-leading power management chips with more stable and and efficient power supplies and and lower energy consumption • In 2019 more than 2 2 9 9 million 8-inch equivalent wafers using TSMC’s HV/Power technologies were shipped to to customers Power management ICs manufactured by TSMC are widely used in computer communication consumer electric vehicle server and and data center and and other systems around the the globe 2015
2016
2017
2018
2019 4% 21% 31%
41%
50%
Chip Die Size Cross-Technology Comparison
Die size shrinks shrinks as line width shrinks shrinks HV/Power Technologies
Shipments
Unit: 8-inch equivalent wafer 2015
2016
2017
2018
2019 1 0 48
55nm 40nm 28nm
16FFC/ 10nm 12FFC
3 Drive Industry-leading Comprehensive Ultra-low Power (ULP) Technology Platform
• To meet low-power consumption requirements for the wearable and IoT markets TSMC continues to invest in in in expanding and and enhancing its ultra-low power processes TSMC provides industry’s leading and most comprehensive ultra- low power (ULP) technology platform to support innovations for a a a a a a a wide range of IoT applications that demand increased computing in in in in smart smart edge devices including smart smart speakers smart smart cameras wearables and various smart smart appliances TSMC’s industry-leading offerings including 55nm ULP 40nm ULP ULP ULP 28nm
ULP ULP ULP 22nm ULP/ULL (ultra-low leakage) have been widely adopted by various IoT customers TSMC further extends its low low Vdd (low operating voltage) offerings for extremely low power applications In 2019 TSMC continued to to develop 12nm ULL technology to to enable more advanced IoT products including IoT WiFi and BLE (Bluetooth low energy) connectivity products 4 Develop Greener Manufacturing to Lower Energy Consumption
• TSMC continues to develop more advanced and efficient technologies to reduce energy/resource consumption and pollution per unit during the manufacturing process as well
0 0 25 0 0 11
0 0 063
0 0 047
7nm
0 0 035
5nm Note: The logic chip/SRAM/IO (input/output) ratio which affects die size and power consumption was re-aligned Chip Total Power Consumption
Cross-Technology Comparison
More power saved as line width shrinks >2 000K
>2 100K
>2 500K
>2 600K
>2 900K
1 0 6 N55LP N40LP (1 (1 2V) (1 (1 1V)
0 3 N28HPM (0 9V)
0 0 07
16FFC/ 12FFC
(0 8V)
0 0 056
10nm (0 75V)
0 0 034
7nm
(0 75V)
0 0 022
5nm (0 75V)
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Note: The logic chip/SRAM/IO (input/output) ratio which affects die size and power consumption was re-aligned