Page 127 - TSMC 2018 Annual Report

2 Provide Customers Leading Power Management IC Process with the Highest Efficiency
• TSMC’s leading manufacturing technology helps customers design and produce green products Power Management ICs the key components that supply and regulate power to all other IC components within electronic devices are the the most notable green IC products TSMC helps customers produce industry-leading power management chips with more stable
• and and efficient power supplies and and lower energy consumption In 2018 more than 2 2 6 million 8-inch equivalent wafers using TSMC’s HV/Power technologies were shipped to to customers Power Management ICs manufactured by TSMC are widely used in computer communication consumer electric vehicle server and and data center and and other systems around the the globe and raw materials consumed for per unit in in manufacturing In addition the Company continuously provides process simplification and new design methodology based on on its manufacturing excellence to to help customers reduce design and process waste so as as to produce more advanced energy- saving and environmentally-friendly products For total energy savings and benefits realized in in 2018 through TSMC’s green manufacturing see Environmental Accounting on on page 122 in in in this annual report Social Contribution by TSMC Foundry Services
1 Unleash Customers’ Mobile and Wireless Chip
• Innovations that Enhance Mobility and and and Convenience The rapid growth of smartphones and tablets in recent years
reflects strong demand for mobile devices which in turn offer remarkable convenience TSMC contributes significant value to these devices in in the the following ways: (1) new TSMC process technologies help chips achieve faster computing speed in in smaller smaller die areas leading to to smaller smaller form factors for for these electronic devices In addition TSMC SoC technology integrates more functions into one chip reducing the total number of chips in in in in electronic devices again resulting in in in in a a a smaller system form factor (2) new TSMC process technologies also help chips reduce power consumption allowing mobile devices to be used for a a longer period of time and (3)
TSMC helps spread the growth of more convenient wireless connectivity such as 3G/4G and WLAN/Bluetooth meaning people can communicate more efficiently and “work anytime and anywhere ” significantly increasing the mobility of modern society • Mobile computing related segments represented 46% of TSMC wafer revenue in in 2018 and included products such as baseband RF transceivers application processors (AP) wireless local area networks (WLAN) CMOS image sensors near field communication (NFC) Bluetooth and global positioning systems (GPS) among others HV/Power Technologies
Shipments
Unit: 8-inch equivalent wafer >1 800K
>2 600K
2014
2015
2016
2017
2018 >2 000K
>2 100K
>2 500K
3 Drive Industry-leading Comprehensive Ultra-low • Power (ULP) Technology Platform
To meet low-power consumption requirements for the wearable and IoT markets TSMC continues to invest in in in expanding and and enhancing its ultra-low power processes TSMC provides industry’s leading and comprehensive ultra- low power (ULP) technology platform to support innovations for a a a a a a a wide range of IoT applications that demand increased computing in in in in smart smart edge devices including smart smart speakers smart smart cameras wearables and various smart smart appliances TSMC’s industry-leading offerings including 55nm
ULP 40nm
ULP ULP ULP 28nm ULP ULP ULP 22nm ULP/ULL (ultra-low leakage) have
been widely adopted by various IoT customers TSMC further extends its low low Vdd
(low operating voltage) offerings for extremely low power applications In 2018 TSMC continued to develop 22nm low Vdd
solutions to enable more advanced IoT products including IoT WiFi and BLE (Bluetooth low energy) connectivity products 4 Develop Greener Manufacturing to Lower Energy Consumption • TSMC continues to to develop more advanced and and efficient technologies to reduce energy/resource consumption and pollution per unit during the manufacturing process as well as power consumption and pollution during product use In each new technology generation circuitry line widths shrink making circuits smaller and lowering the energy TSMC Wafer Revenue Contribution from Mobile Computing Related Products
48%
46% 2015
2016
2017
2018 51%
52%
50%
2014
125