Page 12 - TSMC 2018 Annual Report

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• 7nm FinFET technology entered volume production in in the second quarter of 2018 Customer adoption was strong and with more than 40 product tape-outs received by the end
of 2018 With its superior value proposition these tape- outs came from a a a a wide spectrum of applications including mobile devices game consoles artificial intelligence central processing processing units units graphic processing processing units units and networking devices Compared to 16nm FinFET FinFET technology 7nm FinFET FinFET offers approximately a a a a 35% speed improvement or a a a a 65% power reduction as as well as as more than three times the logic density In addition 7nm FinFET technology can be optimized for for mobile applications and high performance computing devices 7nm FinFET technology also set a a a new Company
• record in in in terms of production production ramp-up speed 12nm FinFET Compact technology (12FFC) which entered volume production in in 2017 is TSMC’s latest family offering following 16nm FinFET Plus technology (16FF+) and 16nm FinFET Compact technology (16FFC) 12FFC drives
die size and power consumption to the the best levels of the the foundry’s 16/14nm technologies 16FF+ which first entered volume production in in 2015 is aimed at customers in in high performance market segments including mobile server graphics and cryptocurrency The cost-effective 16FFC in volume production since 2016 can maximize die cost scaling by incorporating optical shrink and process simplification at at at the same time Both 16FFC and 12FFC can satisfy customer needs in in mainstream and ultra-low-power (ULP) market segments including low-end to mid-range mobile phones consumer electronics digital TVs and the IoT With innovative standard cell structures 12FFC can also be used in more advanced applications So far 16FF+/16FFC/12FFC have received a a a a total of of more than 300 product tape-outs most of of which have been first-time silicon successes • 22nm ultra-low leakage (22ULL) technology development was completed and entered risk production in fourth quarter of 2018 as planned to support IoT and wearable devices applications New ULL ULL device and and ULL ULL SRAM (static random access memory) can provide lower power consumption compared to 40ULP and 55ULP solutions • 22nm ultra-low power (22ULP) technology technology was developed based on TSMC’s industry-leading 28nm technology and completed all process qualifications in the fourth quarter of 2018 Compared to 28nm high performance compact (28HPC) technology 22ULP provides 10% area reduction with more than than 30% 30% speed gain or or or more than than 30% 30% power reduction for applications including image processing digital TVs set-top boxes smartphones and consumer products • 28nm high performance compact plus (28HPC+) technology had accumulated more than 230 product tape-outs as of the the end
of 2018 28HPC+ technology provides further performance enhancement or or power reduction in in mainstream smartphone digital TV storage audio and SoC (System-on- Chip) applications Compared to 28HPC 28HPC technology 28HPC+ technology improves device performance by 15% or or reduces leakage by 50% • 40nm ULP technologies technologies received over 30 product tape-outs in 2018 These technologies target the IoT and wearable devices applications such as wireless connectivity application application processors and sensor hub applications In addition TSMC uses its leading 40nm ULP low Vdd (Low Operating Voltage) technology to produce the world’s lowest energy consumption solutions for for IoT devices devices and for for wearable connected devices devices Still under development are new enhanced analog devices that will enrich the 40ULP platform to to support customers for for more analog design needs in the future • 55nm ultra-low power (55ULP) technology volume production continued and accumulated more than 60 customer tape- outs as of 2018 Compared to 55nm Low Power (55LP) process 55ULP can can significantly increase battery life for IoT applications In addition it it integrates RF (radio frequency) and eFlash (embedded flash) to to simplify customers’ SoC designs Specialty Technology
• 16FF+ technology began production for customer applications in in in the automotive industry in in in 2017 16FFC Foundation IPs (intellectual properties) passed the Automotive Electronic Council AEC-Q100 Grade-1 qualification and were certified
for functional safety standard ISO 26262 ASIL-B In addition TSMC 9000A was introduced for automotive IP management to to complete the automotive ecosystem with third-party
IP vendors TSMC continues to to develop 7nm automotive foundation IPs and plans to have them qualified for AEC-Q100 Grade-2 by the second half of 2019