Page 86 - 2017 TSMC Annual Report

Complementary to to to the the survey quarterly business reviews (QBRs) are also conducted by the the customer customer service team so so that customers can give feedback feedback to to TSMC TSMC on on a a a a a a a a regular basis Through surveys feedback feedback reviews and intensive interaction with customers TSMC TSMC is is able to to stay in close touch for better service and collaboration Customer feedback is routinely reviewed analyzed and then used to to develop appropriate improvement plans all all in in in all all becoming an integral part of the the customer satisfaction process with a a a a a a a a a a complete closed loop TSMC uses data derived from the the survey as a a a a a a a a a a base to to to identify future focus areas TSMC acts on on on the belief that customer satisfaction leads to to to healthy healthy relationships and healthy healthy relationships lead to higher levels of retention and expansion Customers that Accounted for at at at Least 10% of Annual Consolidated Net Revenue
Unit: NT$ thousands
Customer A None None Customer B None None Others
Total Net Revenue
5 4 2 Open Innovation Platform® (OIP) Initiative
Innovation has always been an an an exciting and challenging proposition Competition among semiconductor companies continues
to to grow more more intense in in in in the the face of of increasing customer consolidation and the the commoditization of of technology at at at at more more mature conventional levels Companies must find ways to to to keep innovating in in in in in order to to to survive and prosper One way way to to to accelerate innovation is is is is through active collaboration with external partners At TSMC this is is is is known as the “Open Innovation® approach” and it it is is is is an an “outside in” approach to to complement traditional “inside out” methods TSMC has adopted this path to to innovate via its Open Innovation Platform® initiative which is a a a a a a a key part of the TSMC Grand Alliance The OIP initiative is a a a a a a a a a a comprehensive design technology infrastructure that encompasses all critical IC implementation areas to reduce design barriers and improve first-time silicon success OIP promotes the speedy implementation of innovation amongst the semiconductor design design design community and and its ecosystem partners using TSMC’s IP design design design implementation and and design design design for manufacturability (DFM) capabilities process technology and backend services Crucial to OIP are ecosystem interfaces and and collaborative components initiated and and supported by TSMC that more efficiently empower innovation throughout the the supply chain and and and in in in in turn drive the the creation and and and sharing of of new revenue and and and profits TSMC’s active accuracy accuracy assurance (AAA) initiative is key to OIP providing the the accuracy accuracy and and quality required by the the ecosystem interfaces and and collaborative components TSMC’s Open Innovation® model brings together the the the creative thinking of of customers and partners under the the the common goal of of shortening each of the following: design time time time time time-to-volume time-to-market and ultimately time-to-revenue The model features:
● the foundry segment’s earliest and most comprehensive electronic design automation certification program delivering timely
design tool enhancement required by new process technologies Customer 2017 2016
Net Revenue
As % of 2017 Total Net Revenue
Relation to TSMC Net Revenue
As % of 2016
Total Net Revenue
Relation to TSMC 214 228 766
22%
None 157 185 418
17%
64 096 227
7% None 107 463 238
11%
699 122 248
71%
683 289 688
72%
977 447 241
100%
947 938 344
100%
084