Overview

The TSMC OIP Ecosystem Forum brings together TSMC's design ecosystem companies and our customers to share practical, tested solutions to today's design challenges. Success stories that illustrate TSMC's design ecosystem best practices highlight the event.

More than 90% of last year's attendees said that, "the forum helped me better understand TSMC's Open Innovation Platform" and that "I found it effective to hear directly from TSMC OIP member companies."

This year's event will prove equally valuable as you hear directly from TSMC OIP companies about how to apply their technologies and joint design solutions to address your design challenges in High-Performance Computing (HPC), Mobile, Automotive and Internet-of-Thing (IoT) applications.

This year, the forum is a day-long conference kicking-off with trend-setting addresses and announcements from TSMC and leading IC design company executives.

The technical sessions are dedicated to 30 selected technical papers from TSMC's EDA, IP, Design Center Alliance and Value Chain Aggregator member companies. And theEcosystem Pavilion feature up to 70 member companies showcasing their products and services.

	Emerging advanced node design challenges including 5nm, 6nm, 7nm, 12FFC/16FFC, 16FF+, 22ULP/ULL, 28nm, and ultra-low power process technologies.
	Updated design solutions for specialty technologies supporting Internet-of-Thing (IoT) applications
	Successful, real-life applications of design technologies and IP from ecosystem members and TSMC customers
	Ecosystem-specific TSMC reference flow implementations
	New innovations for next generation product designs targeting HPC, mobile, automotive and IoT applications

Hear directly from ecosystem companies about their TSMC-specific design solutions

Network with your peers and more than 1,000 industry experts and end users.

The TSMC Open Innovation Platform Ecosystem Forum is an "invitation-only" event.  Please register to attend. We look forward to seeing you at the event.