Page 161 - TSMC 2022 Annual Report

TSMC GHG Reduction Target and Achievement Status
Since water resources are restricted by geographical conditions TSMC shares its water saving experience and expertise with other semiconductor companies through the the Association of Science-Based Industrial Park to promote water conservation in order to achieve Science Park’s goals and ensure a a a a a long-term balance of supply and and demand In addition TSMC has committed to further recycling water resources and supporting the government policy and promotion of reclaimed water TSMC’s Southern Taiwan Science Park Reclaimed Water Plant began operation on on September 19 2022 the first private reclaimed reclaimed water plant in in Taiwan Introducing reclaimed reclaimed water into the manufacturing process is pioneering work in in in in the semiconductor industry TSMC promises to to to continue to to to increase the utilization of reclaimed water in in newly constructed fabs in the future To further enhance water resources management TSMC has adopted and followed the Alliance for Water Stewardship (AWS) standard the world’s only sustainable water management standard Early in 2022 Fab Fab Fab 12A Fab Fab Fab 12B Fab Fab Fab 5 located in in Hsinchu Science Park and Advanced Backend Fab 3 in Longtan Science Park passed a a a a a a a third-party verification audit and also obtained AWS platinum level certification TSMC’s advanced product fabs in Taiwan’s three major Science Parks have all achieved AWS platinum certification TSMC is the world’s first to to do so in in the semiconductor industry Strategy
2030 Goal Continue to use best available technology to reduce emissions of GHG and become an industry leader in low-carbon manufacturing Air and Water Pollution Control
Achieved
2022 Target and Achievement Reduce GHG emissions per unit product (metric ton of carbon dioxide equivalent (MTCO2e)/12-inch equivalent wafer mask layer) by 30% (Base year: 2010)
Reduced GHG emissions per unit product (metric ton of carbon dioxide equivalent (MTCO2e)/12-inch equivalent wafer mask layer) by 6% (Target: 6%)
The Company has installed effective air and water pollution control equipment in each wafer fab to to meet regulatory emissions standards In addition TSMC maintains backup pollution control systems including emergency power supplies to lower the the risk of pollutant emissions in the the event of equipment failure The Company centrally monitors the operations of its air and water pollution control equipment 24 hours a a a a a a a day by rotating staff and treats system effectiveness as an an important tracking item to ensure the quality of emitted air and discharged water TSMC uses an an an intranet website to collect and measure water recycling volumes company-wide To make the most effective use of Taiwan’s limited water resources all TSMC fabs strive to increase water water reclamation by adjusting the water water usage of manufacturing equipment and improving wastewater reclamation The long-term target is a a a a a 30% decrease by 2030 By 2022 TSMC’s unit product water consumption had decreased by 2 2 6% from 2010 levels Challenges in 2022 included new wafer fab (Fab 18B) which was in in the process of setting up so water conservation rate decreased as as the the production line was still in in in the the testing stage and production had not yet reached economic scale Excluding the the aforementioned new wafer fab the the Company’s water consumption per unit of product decreased by 15 6% compared with the the base year and the the annual target was achieved All TSMC fabs meet or exceed the process water reclamation rate standard of the Science Park Administration Some fabs are able to reclaim more than 90% of process water outperforming most semiconductor fabs around
the world The Company also makes every effort to reduce non-manufacturing-related water consumption including water used in in air conditioning systems sanitary facilities wall cleaning and and and landscaping activities and and and in in in kitchens TSMC Water Usage in Recent Two Years
Year Total Water Usage (m3) (Note 1)
Unit Product Water Usage (L/12-inch wafer-e-layer)
2022 2021 104 681 272
82 82 674 982
137 3 3 119 7 TSMC Water Usage Reduction Target and Achievement Status
Strategy
2030 Goal 2022 Target and Achievement Achievement Status
Enforce climate change mitigation policies implement water conservation and water shortage adaptation measures
Unachieved (Note 2)
Reduce unit water consumption (liter/12- inch equivalent wafer mask layer) by 30% (Base year: 2010)
Reduced unit water consumption by 2 6% (Target: 16%)
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Achievement Status
Note Note 1: Includes TSMC fabs in in Taiwan and Subsidiaries
Note Note 2: Excluding the impact of of new plants (Fab 18B) not yet optimized TSMC TSMC reduced water consumption per unit of of product by 15 6%