Page 7 - TSMC 2019 Annual Report

In its second year of of ramp N7 N7 received more than 100 customer product tape-outs by the end of of 2019 while N7+ began volume volume production production with EUV Our N6 N6 is on on on track for for volume volume production production before the end of 2020 N6 N6 provides a a a clear migration path for next wave N7 products Leveraging our our leadership at 28-nanometer our our 22ULP (ultra-low (ultra-low power) and 22ULL (ultra-low (ultra-low leakage) technologies both began volume production in 2019 22ULL supports supports IoT and wearable device applications while 22ULP supports supports image processing digital TVs set-top boxes and other consumer products We also extended our 16-nanometer offerings with 12FFC+ and 16FFC+ in in in 2019 to to support customer needs in in in ultra-low-power applications TSMC’s advanced packaging solutions enable system integration integration with wafer level process by seamless integration integration of of front end end wafer process and backend chip packaging In In 2019 we offered the 5th generation InFO solutions with finer interconnect line width and and spacing to enable both mobile and and high performance computing products TSMC’s CoWoS® continued to integrate with larger interposer size for heterogeneous integration We also are developing TSMC-SoIC® (System-on-Integrated Chip) an industry-leading 3D chip chip stacking solution that enables multiple chips in in in in close proximity to deliver the best system performance TSMC’s ecosystem Open Innovation Platform® (OIP) empowers our 499 distinct customers to to unleash their innovations with fast time-to-market In 2019 we continued to to to add partners to to to our OIP Cloud Alliance which offers our customers to to design design in in a a a a a safe and secure cloud cloud environment environment This cloud cloud design design environment environment significantly increases design productivity We also worked with our our ecosystem partners to to expand our our libraries and and silicon IP portfolio to to over over 26 000 items in 2019 More than 10 600 technology files and over over 360 process design kits from 0 0 0 0 0 0 0 0 0 5-micron to 5-nanometer are available to to to customers via TSMC-Online We saw more than 100 000 customer customer downloads in in 2019 Corporate Social Responsibility
At TSMC we are dedicated to to sound corporate governance and pursue profitable growth We also commit to to the environment society and balancing the interests of all stakeholders A sound corporate governance built upon our core values is the the foundation of of TSMC’s corporate social responsibility As an an important member of of the the global semiconductor industry we recognize it it is our responsibility to to to face up to to to the increasingly challenging global environment and lead by example In 2019 we established the Corporate Social Responsibility
Executive Executive Committee led by Chairman The Executive Executive Committee will work with senior management across many key functions and the existing CSR committee to set our CSR strategy and align with UN Sustainable Development Goals Our focuses are driving actions on on green manufacturing creating an an an inclusive workplace for talent development building a a a a a a a a a a responsible supply chain and caring for the underprivileged We will work hard to to fulfill our role to to pursue a a a a sustainable future