Page 17 - TSMC 2019 Annual Report

15
optimize its high performance computing platform offerings to help customers capture market growth driven by data explosion and application innovation Internet of Things: TSMC provides leading comprehensive and highly integrated ultra-low power (ULP) technology platform to support innovations for IoT and wearable applications The Company’s leading offerings including 55nm ULP ULP 40nm ULP ULP 28nm ULP ULP and 22nm ULP/Ultra-low leakage (ULL) have been widely adopted by various IoT and wearable applications TSMC has also extended its low low Vdd (low operating voltage) offerings for extreme low-power applications To support the ever-increasing demand in in in in IoT edge computing and and wireless connectivity TSMC also offers the most competitive and comprehensive leading-edge specialty technologies in in RF enhanced analog devices embedded flash memory emerging memory sensors and display chips as as well as as multiple advanced packaging technologies including leading InFO technology Automotive electronics: TSMC offers leading automotive technologies to support the three megatrends – safer smarter and greener – in in the automotive industry The Company is also the industry leader in in in providing a a a a robust automotive IP ecosystem which covers 16nm FinFET first and extends to 7nm FinFET FinFET and 5nm FinFET FinFET for advanced driver-assistance systems (ADAS) and advanced in-vehicle infotainment (IVI) the two most computationally demanding systems in in the automotive industry In addition to its advanced logic platform TSMC offers broad and competitive specialty technologies including 28nm embedded flash memory 28nm 22nm and 16nm mmWave RF high sensitivity CMOS Image/LiDAR (light detection and ranging) sensors and and power management ICs Magnetic random access memory (MRAM) an emerging technology is being developed with good progress to to meet automotive Grade-1 requirements All these automotive technologies are applied to to TSMC’s automotive process qualification standards based on on AEC-Q100 standards TSMC continually strengthens its core competitiveness and deploys both short-term and and long-term plans for technology and and business development and assists customers in in in taking on the challenges of short product cycles and intense competition in in the electronic products market to meet ROI and growth objectives •
1 2 3 4
•
1 2 3 Short-Term Semiconductor Business Development Plan
Substantially ramp up the business and sustain advanced technology market share by continued increasing capacity and R&D investments Maintain mainstream technology market share by expanding business to to new customers and market segments Continue to enhance the the competitive advantages of the the Company’s platforms in smartphone high performance computing IoT and automotive electronics design ecosystems so as to expand TSMC’s dedicated foundry services in these product applications Further expand TSMC’s business and and service infrastructure into emerging and developing markets Long-Term Semiconductor Business Development Plan
Continue developing leading-edge technologies at a a a a pace consistent with the Moore’s Law Broaden specialty business contributions by further developing derivative technologies Provide more integrated services covering system-level integration design design design design design design technology definition design design design tool preparation wafer processing and backend services all of which deliver more value to to customers through optimized solutions