Page 7 - TSMC 2018 Annual Report

Our 5-nanometer technology development is is well on-track for risk production in the second quarter of 2019 We have made significant progress in in in transistor and and interconnect performance yield learning and and reliability qualification Customer product product tape-outs are scheduled in the first half of 2019 with volume production next year We expect to to see a a a a a a significant number of customers leverage our 5-nanometer to to establish leadership positions for their products Furthermore our 3-nanometer technology has entered the the full development stage TSMC has been offering advanced advanced packaging technology to integrate advanced advanced SoCs high bandwidth memories and and integrated passive device to enhance system-level performance In In 2018 we offered the 4th generation InFO solutions with finer interconnect line width and and spacing to enable both mobile and and high performance computing products TSMC’s CoWoS® offers a a a a a platform for for heterogeneous integration with increasing interposer sizes In May 2018 we announced TSMC-SoICTM (System-on-Integrated Chips) solution solution a a a a a a a clear industry-leading 3D IC IC packaging solution solution integrating multiple heterogeneous chiplets with close proximity to deliver even higher system performance TSMC’s ecosystem the Open Innovation Platform® (OIP) is an an important factor in in empowering customers to to to unleash their innovations with fast time-to-market In October 2018 we launched our virtual design environment (VDE)
that that allows our customers to to conduct their design activities in a a a a a a a a secure and safe cloud environment that that significantly increases their design productivity We continued to to work with our our ecosystem partners to to expand our our libraries and and silicon IP portfolio to more than than 20 000 000 items More than than 9 000 000 technology files and over 300 process design kits are available to to to customers via TSMC-Online which saw more than 100 000 customer customer downloads in in 2018 Corporate Developments
After having led the the the company for over 31 years TSMC’s Founder Dr Morris Chang retired from the the the Company after the the the Annual Shareholders’ Meeting on June 5 2018 At the meeting TSMC shareholders elected a a a a a new Board of Directors which then convened to elect Dr Dr Mark Liu as as Chairman and and Dr Dr C C C C C C C C C C Wei as as Chief Executive Officer (CEO) and and Vice Chairman