Page 16 - TSMC 2018 Annual Report

14
Strategy
TSMC is confident that its differentiating strengths will enable it it to prosper from the foundry segment’s many attractive growth opportunities In light of the rapid growth in four major markets namely mobile high performance computing automotive electronics and and the the Internet of Things and and the the fact that focus
of customer demand is shifting from process-technology- centric centric to product-application-centric TSMC has constructed four different technology platforms to to provide customers
with the most comprehensive and competitive logic process technologies technologies specialty technologies technologies IPs and and packaging and and testing technologies to to to shorten customers’ time-to-design and time-to-market Mobile platform: TSMC offers leading process technologies such as 5nm FinFET FinFET FinFET 7nm 7nm FinFET FinFET FinFET Plus 7nm 7nm FinFET FinFET FinFET 10nm
FinFET FinFET 16nm FinFET FinFET Plus (16FF+) and 20nm SoC logic process technologies as as well as as comprehensive IPs for premium product applications to further enhance chip performance reduce power consumption and decrease chip size From low-end to high-end product applications TSMC offers leading process technologies such as 12nm FinFET Compact technology (12FFC) 16nm FinFET Compact technology (16FFC) 28nm high performance compact compact (28HPC) 28nm high performance mobile compact compact plus (28HPC+) and 22nm ultra-low power (22ULP) logic process technologies in addition to to comprehensive IPs to to satisfy customer needs for for high performance and low-power chips Furthermore for premium high-end mid-end and low-end product applications TSMC also offers the most competitive leading-edge specialty technologies including RF embedded flash memory memory emerging memory memory technologies power management sensors and display chips as as well as as advanced packaging technologies such as the leading Integrated Fan-Out (InFO) technology High performance computing platform: TSMC provides customers
with leading process technologies such as 5nm FinFET FinFET FinFET FinFET 7nm 7nm FinFET FinFET FinFET FinFET Plus 7nm 7nm FinFET FinFET FinFET FinFET and 16nm FinFET FinFET FinFET FinFET as as well as as comprehensive IPs IPs including high-speed interconnect IPs IPs to meet
customers’ high performance computing and communication requirements TSMC also offers multiple advanced packaging technologies technologies such as CoWoS® InFO and 3D IC technologies technologies to enable homogeneous and heterogeneous chip integration
to to meet
customers’ performance power and system footprint requirements TSMC will continue to optimize its high performance computing platform offerings to to help customers
capture market growth driven by data explosion and application innovation Automotive electronics platform: TSMC offers industry’s leading automotive technology to to support the three megatrends – safety connectivity and green – in in the automotive industry TSMC is also the industry leader in in in providing a a a a robust automotive IP ecosystem which covers 16nm FinFET first and extends to 7nm FinFET for advanced driver-assistance systems (ADAS) the most computation demanding system in in in the automotive industry In addition to the advanced logic technology platform TSMC offers broad and competitive specialty technologies including 40nm embedded flash memory 28nm and 22nm mmWave RF high sensitivity CMOS Image/LiDAR sensors and power management IC technologies technologies All these automotive technologies technologies are applied
to to TSMC’s automotive process qualification standards based on on AEC-Q100 standards Internet of Things platform: TSMC provides industry’s leading and comprehensive ultra-low power (ULP) technology platform to support innovations for IoT and wearable applications TSMC’s industry-leading offerings including 55nm ULP 40nm ULP ULP ULP 28nm ULP ULP ULP 22nm ULP/Ultra-low leakage (ULL) have been widely adopted by various IoT and wearable applications TSMC also extends its low Vdd (Low Operating Voltage) offerings for extreme low-power applications To support the ever-increasing demand in in IoT edge computing and and wireless connectivity TSMC also offers the most competitive and comprehensive leading- edge specialty technologies in RF embedded flash memory emerging memory sensors and display chips as as well as as multiple advanced packaging technologies including leading InFO technology