Page 8 - 2017 TSMC Annual Report

We successfully introduced TSMC s s s s s s s 7-nanometer 7-nanometer technology in in 2017 Customer adoption of 7-nanometer 7-nanometer is very strong and we received more more than than ten product product tape-outs tape-outs in 2017 A total of more more than than 50 customer product product tape-outs tape-outs are expected by the the end of 2018 2018 TSMC s s s 7-nanometer+ technology will be introduced in in 2018 2018 We have already demonstrated the the same yield level of 256M bit SRAM as compared to 7-nanometer Furthermore TSMC s s s s 5-nanometer technology development is is well on on track for risk production in the the first quarter of 2019 Both device performance and SRAM development vehicle yield improvement are are on our plan Customer test chips are are already running in in our fab In In advanced advanced packaging TSMC s s s second generation InFO technology began volume production for advanced advanced mobile products in in 2017 while InFO_oS (Integrated Fan-Out on on Substrate) technology is expected to complete qualification in in 2018 for HPC (high performance computing) products We also extended our interposer CoWoS technology to 12-nanometer and are actively developing 7-nanometer solutions to further support the the requirements of HPC applications such as AI data server and networking TSMC s s s s s s s ecosystem the the Open Innovation Platform (OIP) is an an important factor in in empowering customers to to to unleash their innovations with with fast time-to-market We continued to to to work with with our our ecosystem partners to to to expand our our libraries and and silicon IP portfolio in 2017 to more than than 16 000 000 items More than than 9 000 000 technology files and over 300 process design kits were available to to to customers via TSMC-Online which saw more than 100 000 customer customer downloads in in 2017 Corporate Developments
In October 2017 I I as as TSMC Chairman for the the last thirty years announced my plan to to retire from the the Company immediately after the the Annual Shareholders Meeting in in early June 2018 All present directors of the the board except myself have unanimously agreed to to be nominated and if elected will serve as directors of the the board during the the next term They all have agreed to have TSMC TSMC under the dual leadership of Dr Dr Mark Liu and and Dr Dr C C C C C C C C C C C C Wei who are TSMC TSMC s s s s s presidents and and Co-CEOs currently Dr Dr Liu will will be be the the the Chairman of the the the Board and Dr Dr Wei will will be be the the the Chief Executive Officer Honors and Awards
TSMC received recognition for for achievements in in in in innovation business information disclosure corporate governance sustainability investor relations and overall excellence in in in in in management from organizations including Forbes Fortune Magazine Magazine Newsweek CommonWealth Magazine Magazine The Nikkei PricewaterhouseCoopers RobecoSAM and the Taiwan Stock Exchange TSMC continued to to to receive multiple awards from Institutional Investor Magazine and was ranked among the top global companies by IR Magazine TSMC was chosen once again as as a a a a a a a a a a a component of the Dow Jones Sustainability Indices becoming the only semiconductor company to to be be selected for 17 consecutive years Meanwhile we remained a a a a a a major component in in in in in both MSCI ESG and and FTSE4Good Emerging Index reflecting our ongoing commitment to sustainability and and corporate social responsibility 006