Page 17 - 2017 TSMC Annual Report

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Mobile platform: TSMC offers leading process technologies such as 7nm FinFET FinFET FinFET 10nm FinFET FinFET FinFET 16nm FinFET FinFET FinFET Plus technology and 20nm SoC logic process technologies as well as comprehensive IPs for premium product applications
to further enhance chip performance reduce power consumption and decrease chip size For low-end to high-end product applications
TSMC offers leading process technologies such as 12nm FinFET FinFET Compact technology 16nm FinFET FinFET compact compact technology 28nm 28nm high performance compact compact 28nm 28nm high performance mobile compact plus and 22nm ultra-low power logic process technologies in addition to comprehensive IPs to to satisfy customer needs for for high-performance and low-power chips Furthermore for premium high-end mid-level and low-end product applications
TSMC also offers the most competitive leading-edge specialty technologies including RF embedded flash memory memory emerging memory memory technologies power management sensors and display chips as as as well as as as advanced packaging technologies such as as as the leading integrated fan-out (InFO) technology High-performance computing platform: TSMC provides customers with leading process technologies such as 7nm FinFET FinFET and 16nm FinFET FinFET as as well as as comprehensive IPs including high-speed interconnect IPs to to meet customers’ high-performance computing and communication requirements TSMC also offers multiple advanced packaging technologies technologies such as CoWoS® and 3D IC technologies technologies to enable homogeneous and heterogeneous chip integration to to meet customers’ performance power and system footprint requirements TSMC will continue to optimize its high-performance computing platform offerings to help customers capture market growth driven by data explosion and application innovation Automotive electronics platform: TSMC offers leading 7nm FinFET FinFET 16nm FinFET FinFET 28nm and 40nm logic process technologies various leading and competitive specialty technologies in RF embedded flash memory sensors multiple power management technologies that pass the AEC-Q100 qualifications IoT platform: TSMC provides industry’s leading and comprehensive ultra-low power technology platform to support innovations for IoT and wearable applications
TSMC’s leading offerings including 55nm ULP ULP 40nm ULP ULP 28nm ULP ULP 22nm ULP/Ultra-low leakage have been widely adopted by various IoT and wearable applications
TSMC extends its offering with Near-Vt technology for extreme low power applications
TSMC also offers the most competitive and leading-edge specialty technologies in in RF embedded flash memory memory emerging memory memory sensors and display chips as well as multiple advanced packaging technologies including leading InFO technology TSMC continually strengthens its core competitiveness and deploys both short-term and and long-term technology and and business development plans and assists customers in in in taking on the challenges of short product cycles and intense competition in the electronic products market to meet ROI and growth objectives ● Short-Term Semiconductor Business Development Plan 1 Substantially ramp up the business and sustain advanced technology market share by continually increased capacity and R&D investments 2 Maintain mainstream technology market share by expanding
business to to new customers and market segments with off-the-shelf technologies 3 Continue to enhance the competitive advantages of TSMC’s platforms in in mobile high-performance computing automotive electronics and IoT design ecosystems so as to to expand TSMC’s dedicated foundry services in these product applications
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Further expand TSMC’s business and and service infrastructure into emerging and developing markets ● Long-Term Semiconductor Business Development Plan 1 2 3 Continue developing leading-edge technologies at a a a a pace consistent with Moore’s Law Broaden specialty business contributions by further developing derivative technologies Provide more integrated services covering system-level integration design design design design design design technology definition design design design tool preparation wafer processing and backend services all of which deliver more value to to customers through optimized solutions